In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More
Podcast EP237: The Expanded Use of Functional Test Patterns for Manufacturing with Robert Ruiz
Dan is joined by Robert Ruiz, a product management director responsible for strategy and business growth of several verification products at Synopsys. Robert has held various marketing and technical positions for leading functional verification and test automation products at various companies including Synopsys, Novas… Read More
CEO Interview: Dr. Babak Taheri of Silvaco
Babak A. Taheri, Ph.D., has served as Chief Executive Officer and member of the Silvaco board of directors from August 2019 to September 2021 and from November 2021 to present. From October 2018 to August 2019, Dr. Taheri served as our Chief Technology Officer and Executive Vice President of Products.
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… Read MoreEmpowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology
The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More
CEO Interview: Dr. Pierre-Yves Lesaicherre of Finwave
Dr. Lesaicherre holds an MBA with a focus on International Business and Strategy from INSEAD, and has an MS degree and a PhD degree in Material Science from the Grenoble Institute of Technology (Grenoble INP). He is a Board Leadership Fellow, Governance Fellow and Director Certified for NACD (National Association of Corporate… Read More
Samtec Simplifies Complex Interconnect Design with Solution Blocks
The development of cost effective, high-performance silicon to silicon interconnect at the system level can be a vexing problem. So many choices, which one will work best? Ease of use and customer support are woven into the DNA of Samtec. Almost four years ago I explored the company’s focus on putting the customer first here. Fast-forward… Read More
Perforce IP and Design Data Management #61DAC
I recall first blogging about Helix IPLM (formerly Methodics IPLM) at DAC in 2012, then Perforce acquired the company in July 2020, so I stopped by the Perforce booth this year at DAC to get an update from Martin Hall, Principal Solutions Engineer at Perforce. Martin’s background includes working at Dassault Systemes, Synchronicity,… Read More
IROC Introduces an Upgraded Solution for Soft Error Analysis and Mitigation #61DAC
#61DAC Is the place to go for the latest ideas, technology and products for semiconductor design and manufacturing. Between the exhibit floor and the technical program, you can get a vast education on almost any topic. In this post, I will focus on a unique company and a new version of a unique solution. IROC Technologies specializes… Read More
Cadence® Janus™ Network-on-Chip (NoC)
A Network-on-Chip (NoC) IP addresses the challenges of interconnect complexity in SoCs by significantly reducing wiring congestion and providing a scalable architecture. It allows for efficient communication among numerous initiators and targets with minimal latency and high speed. A NoC facilitates design changes, enabling… Read More
A Joint Solution Toward SoC Design “Exploration and Integration” released by Defacto #61DAC
When I was at DAC last month, I had the chance to talk with Chouki Aktouf and Bastien Gratréaux from Defacto and they told me about a new innovative solution to generate Arm-based System-on-Chips. I heard that this solution has now been released.
Defacto and Arm developed a joint SoC design flow to help Arm users cover all needed automation—from… Read More
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