Professor Chris Eliasmith (right side) is co-CEO and President of Applied Brain Research Inc. Chris is also the co-inventor of the Neural Engineering Framework (NEF), the Nengo neural development environment, and the Semantic Pointer Architecture, all of which are dedicated to leveraging our understanding of the brain to … Read More





The Smartphone Snitch in Your Pocket
The story in the New York Times came with a sensational headline: “Couple in Car Survive 300-foot Fall into a Canyon.” The canyon in question was Monkey Canyon in the Angeles National Forest outside Los Angeles and the couple survived, so the story goes, thanks to their satellite-connectivity-enhanced iPhone.
This is the kind… Read More
Formal Datapath Verification for ML Accelerators
Formal methods for digital verification have advanced enormously over the last couple of decades, mostly in support of verification in control and data transport logic. The popular view had been that datapath logic was not amenable to such techniques. Control/transport proofs depend on property verification; if a proof is … Read More
How to Efficiently and Effectively Secure SoC Interfaces for Data Protection
Before the advent of the digitized society and computer chips, things that needed protection were mostly hard assets such as jewelry, coins, real estate, etc. Administering security was simple and depended on strong guards who provided security through physical means. Then came the safety box services offered by financial … Read More
9 Trends of IoT in 2023
The year 2023 will hit all 4 components of IoT Model:
- Sensors,
- Networks (Communications),
- Analytics (Cloud)
- Applications
With different degrees of impact.
IoT Trend 1: Growth in Data and Devices with More Human-Device Interaction
By the end of 2019 there were around 3.6 billion devices that are actively connected to the Internet… Read More
IEDM 2022 – TSMC 3nm
TSMC presented two papers on 3nm at the 2022 IEDM; “Critical Process features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond” and “A 3nm CMOS FinFlexTM Platform Technology with Enhanced Power Efficiency and Performance for Mobile SOC and High Performance Computing Applications”.
When … Read More
Podcast EP134: A New Year’s Perspective with Daniel Nenni and Mike Gianfagna
Dan is joined by his podcast partner and producer Mike Gianfagna. Dan and Mike review the hot topics that trended on SemiWiki over the past year.
Included are discussions about how the semiconductor industry is changing, touching on Moore’s law, chiplets. and government intervention.The forces that are changing semis are… Read More
Analog to Digital Converter Circuits for Communications, AI and Automotive
Sensors are inherently analog in nature, and they get digitized for processing by using an Analog to Digital Converter (ADC) block. At the recent IP SoC event I had the chance to see the presentation by Ken Potts, COO of Alphacore on their semiconductor IP for ADCs. I learned that Alphacore started out in 2012, now offering both standard… Read More
Siemens Aspires to AI in PCB Design
This. AI in PCB design is not a new idea. Other PCB software companies also make that claim. But when a mainstream systems technology company like Siemens talks about the subject, that is noteworthy. They already have an adaptive user interface (UI) for their mechanical modeling suite and to assist in low-code development for application… Read More
The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
cHBM for AI: Capabilities, Challenges, and Opportunities