Sr. APE Engineer

Description

1. Provide IC package solution supporting pre-sales activity; timely respond package inquiries.

2. Collaborate with subcontractor’s engineering team and IC designer to deliver robust package solutions.

3. Participate IC package substrate design, design review; initiate package specs and documentation.

4. Work with DE/PM, subcontractor for prototype build, package characterization and simulation.

Requirements

1. +5 year experience in Assembly field.

2. Familiar with FCBGA , FCCSP product, process, material and design rule.

3. Familiar with Package development flow.

4. Fluent in English writing, reading and oral communication.

5. Be familiar with Allegro APD software.

6. Good team work.