Webinar: Shift Left on Warpage: Thermo-Mechanical Analysis Before the Design Locks

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For packaging, thermal, and mechanical engineers who need trusted warpage insight before stackup, material, and package architecture decisions are locked — and want to see what becomes possible when a full design study fits in an afternoon.

In advanced packaging, warpage is rarely a modeling problem. It is a timing problem. Thermo-mechanical analysis — predicting how heat and process-induced stresses cause a package to deform — typically arrives late in the flow, after stackups, material sets, and die placement are locked. By the time the physics shows up, the decisions it should have informed are done changing.

This webinar examines what becomes possible when solver-accurate thermo-mechanical analysis is available while the design is still moving. Attendees will see thermoelastic warpage predictions run at manufacturing resolution directly from native design files — no meshing, no manual setup — with deterministic, FEA-level accurate results in minutes on a single node. The session covers how one leading semiconductor customer compared a 200-case design-of-experiments sweep against a legacy thermal workflow — about an hour versus roughly 16 hours — and what changes for packaging teams when design exploration moves from something you schedule to something you do in an afternoon.

SPEAKERS:

Satish Radhakrishnan is Head of Semiconductor & Electronics at Vinci, where he works at the intersection of technical strategy, industry engagement, and adoption across semiconductor and electronics markets. His background in simulation, packaging, and applied physical systems informs a practical, engineering-led perspective on deploying advanced physics-based tools in production workflows.

John Bruggeman is CMO at Vinci, where he leads the company’s market narrative and strategic positioning. His work focuses on translating complex technical advances into clear category definition, industry relevance, and market adoption.

This webinar is in partnership with SemiWiki and Vinci.

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