Manager, Assembly Process R&D

Description

System assembly development for high-performance computing.

Qualifications

1. MST degree and above, with 5+ years’ working experience.

2. Expertise on

– Active and passive component SMD (Surface Mount Device) process.

– Socket, connector assembly technology and process.

– Assembly technology of the motherboard to mechanical chassis, such as screw assembly technology of the motherboard to chassis.

– Thermal cooling system assembly technology to motherboard.

3. Fluent in English

Primary Location: Taiwan-Hsinchu
Job: IC Interconnect & PackagingTechnology
Job Posting Date: Mar 24, 2020
Unposting Date: Ongoing