System assembly development for high-performance computing.
1. MST degree and above, with 5+ years’ working experience.
2. Expertise on
– Active and passive component SMD (Surface Mount Device) process.
– Socket, connector assembly technology and process.
– Assembly technology of the motherboard to mechanical chassis, such as screw assembly technology of the motherboard to chassis.
– Thermal cooling system assembly technology to motherboard.
3. Fluent in English
Primary Location: Taiwan-Hsinchu
Job: IC Interconnect & PackagingTechnology
Job Posting Date: Mar 24, 2020
Unposting Date: Ongoing
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To view the job application please visit www.tsmc.com.