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Intel Announces CPU With HBM2 Memory & AMD Graphics

mbello

Member
From New Intel Core Processor Combines High-Performance CPU with Custom Discrete Graphics from AMD to Enable Sleeker, Thinner Devices | Intel Newsroom

(...) "Today, we’re sharing initial details on a new product that does exactly that, reducing the usual silicon footprint to less than half that of standard discrete components on a motherboard. That’s more freedom for OEMs to be creative and deliver innovative thin and light designs with improved thermal dissipation. It also delivers space to add new features, create new board layouts, explore new cooling solutions or increase battery life.The new product, which will be part of our 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group* – all in a single processor package.
It’s a prime example of hardware and software innovations intersecting to create something amazing that fills a unique market gap. Helping to deliver on our vision for this new class of product, we worked with the team at AMD’s Radeon Technologies Group. In close collaboration, we designed a new semi-custom graphics chip, which means this is also a great example of how we can compete and work together, ultimately delivering innovation that is good for consumers." (...)

AMD Delivers Semi-Custom Graphics Chip For New Intel Processor
AMD Delivers Semi-Custom Graphics Chip For New Intel Processor


Strangely, Intel mentioned AMD too many times on their press release. I would have expected they simply say something along the lines of "we designed a new graphics ship...". Instead, they mentioned AMD 5 times, including once in the headline. Intel and AMD BFF?
 
AMD already have a good 4 core mobile x86 product. You would wonder why they didn't just develop their own HBM product without Intel. I think part of the reason is because they didn't have access to EMIB. The normal way to combine a GPU with HBM is to use an interposer, which adds to the cost and physical height of the chip. This would seem to prove that Intel's EMIB has an advantage over other tech that use interposers, like TSMC's CoWoS.
 
Lefty, i agree. EMIB could definitely play a role here.

And from a different perspective, it's nice to see one of the great powers of 3D integration: enabling collaboration between companies. Let's hope we'll see more of this.
 
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