lisapimpinella
New member
September 11-16, 2016 Hyatt Regency In Anaheim 11999 Harbor Blvd. Garden Grove, California, USA, 92840
Abstract Submission Deadline
Friday, February 26, 2016
www.esda.org/events/eosesd-symposia/symposia/
Students submitting an abstract (first author only) will be eligible for reduced (50% off) Symposium registration fee, and waived fees to all Symposium tutorials.
Papers are solicited in the following areas:
Authors must submit a 50-word abstract and 4-page (maximum) summary of their work in PDF format to info@esda.org. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors must designate the appropriate technical area related to their work and submission. Authors are required to use the abstract submission toolkit available on the ESD Association website www.esda.org.
Accepted papers covering selected topics may be considered for review for invited publications in IEEE Transactions on Device and Materials Reliability (TDMR), IEEE Transactions on Electron Devices, the Micro-Electronics Reliability Journal, the Journal of Electrostatics or other appropriate publications.
EOS/ESD Association
7900 Turin Road, Building 3
Rome, NY 13440 USA
Phone: (+1)315-339-6937
e-mail: info@esda.org
Abstract Submission Deadline
Friday, February 26, 2016
www.esda.org/events/eosesd-symposia/symposia/
Students submitting an abstract (first author only) will be eligible for reduced (50% off) Symposium registration fee, and waived fees to all Symposium tutorials.
Papers are solicited in the following areas:
- Advanced CMOS (Analog/Digital) EOS/ESD and Latchup
- ESD Protection in Bipolar, RF, High Voltage and BCD Technologies
- Numerical Modeling and Simulation for On-Chip ESD Protection
- EOS/ESD Failure Analysis, Troubleshooting and Case Studies
- Device Testing: Testers, Methods and Correlation Issues
- System Level EOS/ESD/EMC, HMM
- EOS/ESD Factory Level,Control and Materials Technology
- Chip/Module/Package EOS/ESD Electronic Design Automation
Authors must submit a 50-word abstract and 4-page (maximum) summary of their work in PDF format to info@esda.org. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors must designate the appropriate technical area related to their work and submission. Authors are required to use the abstract submission toolkit available on the ESD Association website www.esda.org.
Accepted papers covering selected topics may be considered for review for invited publications in IEEE Transactions on Device and Materials Reliability (TDMR), IEEE Transactions on Electron Devices, the Micro-Electronics Reliability Journal, the Journal of Electrostatics or other appropriate publications.
EOS/ESD Association
7900 Turin Road, Building 3
Rome, NY 13440 USA
Phone: (+1)315-339-6937
e-mail: info@esda.org