Will spend 500 billion to build six factories in Jiake, two more than expected
TSMC. (Reuters)
2024/03/18 03:11:03
Economic Daily reporters Li Mengshan and Yu Xianmiao/Reporting from Taipei
TSMC (2330) Chiayi Science Park advanced packaging plant new factory investment project, it is reported that the Political Yuan and TSMC have reached a consensus, and will allocate six new factory sites to TSMC in Jiake, two more than the originally expected four. The total investment The amount exceeds 500 billion yuan, mainly to expand CoWoS advanced packaging production capacity, and is expected to be announced in early April.
TSMC did not respond to relevant news. According to the Political Yuan, Vice President of the Executive Yuan Cheng Wen-can has been actively coordinating the move of TSMC’s advanced packaging plant to Jiake in CPIC from the middle of last year to the beginning of last year. The relevant environmental assessment and water and electricity facilities have been inventoried and processed, and construction is expected to start in April. Indirectly confirm relevant rumors.
According to sources, Jiake will become a new cluster for TSMC's advanced packaging production capacity in the future. Among the six new factories, two will be built this year. This coincides with the statement from the Political Yuan that "construction will start in April."
The main reason why TSMC is expanding production is that advanced packaging is in short supply. Take the Huida H100 as an example. After integrating related components through CoWoS, each wafer can only produce about 28 chips. The following B100, due to the size and integration The speed has increased, and the output of each wafer is only 16. It is expected that the output of Huida’s updated AI chips will continue to be reduced by half.
As each new generation of Huida's AI chips is combined with CoWoS, chip output will drop sharply at a half-price discount. However, terminals equipped with AI servers corresponding to Huida's AI chips are increasing steadily. Foreign investors estimate H100 sales in 2024 is 400,000 units, and B100 will increase to 500,000 or 600,000 units. Terminal demand has surged, but front-end output has been declining. CoWoS advanced packaging production capacity has shown a "cliff-like gap", and TSMC must replenish CoWoS production capacity at a faster rate. , in order to ensure that supply customers are safe.
money.udn.com
TSMC. (Reuters)
2024/03/18 03:11:03
Economic Daily reporters Li Mengshan and Yu Xianmiao/Reporting from Taipei
TSMC (2330) Chiayi Science Park advanced packaging plant new factory investment project, it is reported that the Political Yuan and TSMC have reached a consensus, and will allocate six new factory sites to TSMC in Jiake, two more than the originally expected four. The total investment The amount exceeds 500 billion yuan, mainly to expand CoWoS advanced packaging production capacity, and is expected to be announced in early April.
TSMC did not respond to relevant news. According to the Political Yuan, Vice President of the Executive Yuan Cheng Wen-can has been actively coordinating the move of TSMC’s advanced packaging plant to Jiake in CPIC from the middle of last year to the beginning of last year. The relevant environmental assessment and water and electricity facilities have been inventoried and processed, and construction is expected to start in April. Indirectly confirm relevant rumors.
According to sources, Jiake will become a new cluster for TSMC's advanced packaging production capacity in the future. Among the six new factories, two will be built this year. This coincides with the statement from the Political Yuan that "construction will start in April."
The main reason why TSMC is expanding production is that advanced packaging is in short supply. Take the Huida H100 as an example. After integrating related components through CoWoS, each wafer can only produce about 28 chips. The following B100, due to the size and integration The speed has increased, and the output of each wafer is only 16. It is expected that the output of Huida’s updated AI chips will continue to be reduced by half.
As each new generation of Huida's AI chips is combined with CoWoS, chip output will drop sharply at a half-price discount. However, terminals equipped with AI servers corresponding to Huida's AI chips are increasing steadily. Foreign investors estimate H100 sales in 2024 is 400,000 units, and B100 will increase to 500,000 or 600,000 units. Terminal demand has surged, but front-end output has been declining. CoWoS advanced packaging production capacity has shown a "cliff-like gap", and TSMC must replenish CoWoS production capacity at a faster rate. , in order to ensure that supply customers are safe.
先進封裝廠台積電大加碼 將砸5,000億在嘉科蓋六座廠 | 產業熱點 | 產業 | 經濟日報
台積電嘉義科學園區先進封裝廠新廠投資案，傳出政院與台積電已有共識，將在嘉科撥出六座新廠用地給台積電，比原本預期的四座多兩...
