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In principle, you are correct. But, in practice, all significant 2.5D/3D-IC assemblies are designed by a single company and manufactured by a single foundry. The exception to this is HBM which is a standardized market component. But all the chiplets and the interposer are designed by vertically...
Hi M.Y. - The one-stop-shop idea assumes that a single company will give you the best solutions across all problem spaces. That is not realistic as 3D-IC is driving chip designers to take on more system-level analysis physics than traditionally appear in a monolithic chip design. Things like...
My view is that the CHIPS Act is driven by geopolitical concerns, not economics. The US needs secure, on-shore semiconductor manufacturing and is willing to subsidize it to make it happen - for security/political reasons, not to get cheaper chips.
Dan called out the real Achilles' heel of this...
Check out Aditazz (www.aditazz.com). This company is trying to apply EDA methodology and formalisms to the construction industry. For example, the layout of a hospital with all its conduits and constraints on patient transport can be tackled as a layout optimization problem. I know the founders...
