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Recent content by John Alderman

  1. J

    TechInsights teardown of Exynos 990 reveals scary Samsung 7nm BEOL

    Different issues but at these fine dimensions and low voltages is electromigration a consideration for more metal or possible need for via / contact overlap tolerance aided by slightly larger metal to gap an advantage ?
  2. J

    TechInsights teardown of Exynos 990 reveals scary Samsung 7nm BEOL

    Presume referring to line width being kept larger. Why not the obvious - to reduce line resistance and hence RC issues.
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