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GENERAL INFORMATION The 2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2) is the 22nd, "rebooted" edition of the System-Level Interconnect Prediction (SLIP) Workshop. As computing systems and applications grapple with a post-Moore, post-CMOS, post-von Neumann future, fundamental interconnect problems and pathfinding challenges have become more critical to address than ever before. SLIP^2, co-located with …
With immense pressure to meet the increasing specifications of electrified propulsion systems for vehicles, engineers must rethink how to predict system performance. Learn how to generate different motor models and evaluate the entire system's behavior throughout development. TIME: MAY 17TH, 2023 10 AM EST Venue: Virtual About this Webinar As the electrification of vehicles has …
Title: WEBINAR l System-Level Thermal Signoff from Chips Through to Racks Date: Wednesday, October 18, 2023 Time: 10:00 AM Eastern Daylight Time Duration: 45 minutes Summary Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive …
Discover how the Sherlock-Workbench integration simplifies, accelerates, and expands mechanical, thermal, and reliability simulations of electronic systems in this upcoming webinar. TIME: APRIL 4, 2024 11 AM EDT / 5 PM CEST / 8:30 PM IST Venue: Virtual Overview In this webinar, you will learn how the Sherlock-Workbench integration simplifies, accelerates, and expands mechanical, thermal, …
