March 24, 2020 12:00 PM - 1:00 PM (EDT) Venue: Online Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical simulations …
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Time: August 24, 2021 1 PM EDT / 6 PM BST / 10:30 PM IST Venue: Online About this Webinar This webinar spotlights major updates to Ansys Electronics Reliability solutions in 2021 R2. Ansys Electronics Reliability solutions feature comprehensive workflows involving Ansys Sherlock, Ansys Mechanical, Ansys Icepak, Ansys LS-DYNA and more. We will cover product integrations, relevant updates for each tool that will enable faster …
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Learn about the latest updates to the Electronics Reliability product portfolio, including more advanced integrations between Mechanical, LS-DYNA, Sherlock & Icepak. TIME: MARCH 1, 2023 11 AM EST About This Webinar Ansys 2023 R1 introduces significant advances across the Ansys suite of tools supporting Electronics Reliability applications. In addition to critical enhancements within Ansys Sherlock, …
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