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The automotive industry is undergoing a seismic shift. Supply chain constraints, software defined architectures, functional safety requirements, and the changing dynamics between OEMs, Tier 1s and semiconductor companies, are driving the industry to seek innovative ways to approach new challenges. Join us on Tuesday, April 12th, 2022, for a special panel discussion as we review …
HYBRID FORMAT SEPTEMBER 29-30, 2022 AIM OF THE WORKSHOP With increasing system complexity, security, stringent runtime requirements for functional safety, and cost constraints of a mass market, the reliable and secure operation of electronics in safety- critical, enterprise servers and cloud computing domains is still a major challenge. While traditionally design time and test time …
November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET (A recording will be sent after the live event to all registrants) The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1 As the semiconductor industry …
SoCs have become very complex silicon solutions. They now consist of 100s of millions or billions of gates, 100 or more discrete Semiconductor Intellectual Property (SIP) blocks, megabytes of volatile and non-volatile embedded memory and multiple CPU cores. Join us on Thursday, April 27 for this 30-minute webinar as we describe and quantify the benefits …
The surge in applications such as AI, HPC, and GPU-intensive workloads requires unparalleled performance, placing cloud vendors and enterprise datacenters under immense pressure to simultaneously maximize power efficiency, reduce costs, and adhere to stringent environmental standards. Join us for a 1-hour panel discussion featuring unique perspectives from industry experts at Intel, Microsoft, Arm and proteanTecs. We will explore …