Learn how to apply process integration and design optimization principles to computational fluid dynamics problems. Time: June 17, 2021 10 AM EDT / 3 PM BST / 7:30 PM IST Venue: Online In this webinar we will show how the power of interactive visualization and artificial intelligence (AI) technologies enables engineers and designers to gain …
LIVE WEBINAR | 21 JULY 2021 | 01:00 PM EST Learn how Simcenter supports the development of electric motors and inverters in this webinar series - Addressing the engineering challenges of electrification. This session explores how to frontload your development by sizing a motor appropriately to balance performance against energy consumption and thermal management. It also includes …
Continue reading "Development of Motor Design and Integration"
LIVE WEBINAR | 26 JULY 2021 | 01:00 PM EST Learn how Simcenter can help with battery design from cell to pack integration in this webinar series - Addressing the engineering challenges of electrification. This session focuses on initial system-level simulation and integration with BiW, pack thermal simulation, controller designer, and thermal run away. The presentation compares …
Continue reading "Challenges in Battery Design and Integration"
Intelligent Cross-Platform Workflows for RF PCB Integration November 2, 2021 Overview RF IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between RF design and manufacturing layout design platforms. Overcoming cross-platform interoperability issues shortens turnaround times and eliminates potential design errors. This webinar will demonstrate the ways in which the Cadence® …
Continue reading "CadenceTECHTALK: Intelligent Cross-Platform Workflows for RF PCB Integration"
Time: February 16, 2022 9 AM EST / 2 PM BST / 7:30 PM IST Venue: Online About this Webinar This webinar completes our series of two Ansys Electrification IBP …
Continue reading "Batteries and Electrified Powertrain System Integration"
Date: Tuesday, September 20, 2022 Time: 10:00am PDT / 1:00pm EDT The RF PA MMIC worked as designed until it was integrated into the module housing, and then the overall …
Continue reading "CadenceTECHTALK: In-Design EM Analysis Addresses RF System Integration Challenges"
November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET (A recording will be sent after the live event to all registrants) The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1 As the semiconductor industry …
