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Intelligent Cross-Platform Workflows for RF PCB Integration November 2, 2021 Overview RF IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between RF design and manufacturing layout design platforms. Overcoming cross-platform interoperability issues shortens turnaround times and eliminates potential design errors. This webinar will demonstrate the ways in which the Cadence® …
Time: February 16, 2022 9 AM EST / 2 PM BST / 7:30 PM IST Venue: Online About this Webinar This webinar completes our series of two Ansys Electrification IBP webinars. We'll share our solutions for battery and management systems. You'll learn the integration of battery, inverter, and electric motor components to design electric powertrains. …
Date: Tuesday, September 20, 2022 Time: 10:00am PDT / 1:00pm EDT The RF PA MMIC worked as designed until it was integrated into the module housing, and then the overall …
Solving Vehicle Electromagnetic and Connectivity Challenges Webinar Series: May - July 2023 This free to attend webinar series will discuss the latest simulation processes, technologies and best practices to enable you to design, analyze and optimize the electromagnetic and electronic performance of your next vehicle. Attend and learn how you can optimize antenna placement, significantly …
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges however, especially in the context of IP …
Overview Title: Unveiling the Secrets to Proper Version Control, Seamless Data Integration, and Effective Collaboration Date: Wednesday, August 23, 2023 Time: 10:00 AM Pacific Time Duration: 30 minutes (+15 minutes live Q/A) Join us on Wednesday, August 23rd, to learn how to master semiconductor design success as we unveil the secrets to proper version control, seamless data integration, and effective …
In today's fast-paced manufacturing world, keeping up with changing customer demands is crucial. Imagine a situation where your customer orders eco-friendly packaging and expects fast changes and top-notch quality. Can your processes handle this smoothly, or do they lead to manual work, higher costs, and slower operations? The answer lies in connecting the shop floor …
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IEEE vTools Events is more than just a place to report past meeting activity. It is an event management tool that enables IEEE Sections, Subsections, Chapters, Affinity Groups and Student Branches to schedule, promote and report (L31) IEEE meetings and events. vTools Events also offers event registration which, if setup, will automatically send the proceeds …
Join us for an insightful presentation into the integration of Synopsys Verdi® and Euclide IDE, revolutionizing the debugging landscape for hardware designers. In this session, we’ll delve into next-generation Verdi’s …
(Work email required for verified registration) During a project, subsystem and full-chip integration plays a crucial role. Integration can be particularly challenging on large SoCs with distributed teams due to complexity of the integration process, multi-site infrastructure issues, as well as the need to collaborate across multiple time zones. Often, integrators must integrate design blocks …
