In this webinar we will examine some of the key features and advantages of Utmost IV for device modeling and characterization, and the major design flows where Utmost IV is a key component. We will also present the latest product enhancements and introduce the new Utmost IV Corner and Retargeting Module. To conclude, we will …
Tuesday, September 27 | 10 am EDT (New York) | 9 am CDT (Chicago) | 7 am PDT (San Francisco) | 4 pm CET (Central Europe) In this webinar, Bill Calver, Director of AcuSolve Program Management, will discuss CFD Transient simulation on Autoclave designs to replicate FDA & ISO procedures for condensation/evaporation for sterilization cycles. You will learn …
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full …
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