In this webinar we will examine some of the key features and advantages of Utmost IV for device modeling and characterization, and the major design flows where Utmost IV is a key component. We will also present the latest product enhancements and introduce the new Utmost IV Corner and Retargeting Module. To conclude, we will …
Tuesday, September 27 | 10 am EDT (New York) | 9 am CDT (Chicago) | 7 am PDT (San Francisco) | 4 pm CET (Central Europe) In this webinar, Bill Calver, Director of AcuSolve Program Management, will discuss CFD Transient simulation on Autoclave designs to replicate FDA & ISO procedures for condensation/evaporation for sterilization cycles. You will learn …
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full …
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The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, …
Presented by Mark Quartermain, Director IoT Technology Management & Matthias Hertel, Senior Manager - Embedded Tools Integration About this talk The ability to add greater levels of intelligence to endpoint devices opens up a huge variety of new use cases. However, achieving the required levels of DSP and ML compute performance in these devices - …
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The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts …
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