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Electronic components design and their integration on PCBs involve complex simulations to accurately predict EM fields and forces. These simulations can be computationally intensive and time-consuming. High-performance computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. Maxwell's ECAD capability allows modeling and …
Whether you’re conducting safety analyses at the system, software, or hardware level, medini analyze can help you achieve: Up to 50% increased efficiency in your functional safety analyses, End-to-end traceability, including integration with your requirements management system, Consistency across your organization with the built-in configurable workflows to capture best practices TIME: JULY 10, 2024 11 AM - 12 AM …
Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities. TIME: JULY 18, 2024 11 AM EDT Venue: Virtual Overview This Ansys 2024 R2 webinar reviews the updates, enhancements, and new features …
Learn how you can improve the accuracy of your simulations with high-quality, consistent materials and data information that are seamlessly available within your simulation tools in this upcoming webinar. TIME: …
