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proteantecs november 16 2022

Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

Online

November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET (A recording will be sent after the live event to all registrants) The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1 As the semiconductor industry …

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SEMICON Japan + Advanced Packaging and Chiplet Summit

Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, Japan

December 14-16, 2022 Venue: Tokyo Big Sight SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging …

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