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proteantecs november 16 2022

Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

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November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET (A recording will be sent after the live event to all registrants) The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1 As the semiconductor industry …

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