Hardware and Architectural Support for Security and Privacy (HASP) 2024

Austin, TX Austin, TX, United States

Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects is still a new frontier. In the era of cloud computing, smart devices, and novel nano-scale devices, practitioners and researchers have to address new challenges …

APCCAS 2024

CHANG YUNG-FA FOUNDATION International Convention Center (CYFF) No.11, Zhongshan S. Rd., Taipei City, Taiwan

The APCCAS is a major international forum for researchers, scientists, educators, students and engineers to exchange their latest findings in circuits and systems. It covers a wide range of topics …

IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)

Huntsville Marriott at the Space & Rocket Center 5 Tranquility Base, Huntsville, AL, United States

About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …

SEMICON Europa 2024

Messe Munchen Munich, Germany

SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support …

Advanced Design & Manufacturing Montréal 2024

Palais des congrès de Montréal 1001 Place Jean-Paul-Riopelle, Montréal, Québec, Canada

Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder & Bulk Solids. This all-in-one, industry-wide event lets you explore the latest trends and technologies shaping the future in advanced design and manufacturing across automation, …

Advanced Packaging Conference (APC) 2024

Messe Munchen Munich, Germany

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …

Defect-Based Testing

Munich, Germany

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …

2024 SIA Awards Dinner

Signia by Hilton San Jose 170 S Market St, San Jose, CA, United States

Date: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 REGISTER HERE