Presentations 6 x four hour short courses from thermal thought leaders Thermal conference with 50+ technical papers & how-to’s from leading companies and universities Numerous FREE tear down sessions and product workshops for all attendees Exhibits 40+ companies set up to show off their capabilities Technical sales engineers who are ready to introduce and demonstrate …
About The Arm Tech Symposia is a global annual event designed to share with customers our first-hand market observations, the latest Arm technology and roadmaps, the diverse up-to-date Arm-based devices, architectures and applications. This is also an opportunity for partners from the Arm Community and ecosystem to get together to demonstrate their Arm-based products & …
The European Processor Initiative is organizing its first EPI Forum on March 16 and 17, 2020, in Paris, France. EPI Forum will gather experts from the HPC ecosystem, stakeholders in the field and EPI researchers and engineers to discuss and present EPI’s achievement so far and future developments in the Initiative. In order to register …
March 17, 2020 11:00 AM - 12:00 PM (EST) Venue: Online ANSYS Fluent provides the widest range of multiphase models to accurately simulate your toughest challenges. Learn about recent innovations, including: A streamlined workflow that makes it simple to set up complex multiphase simulations faster, with confidence An innovative AIAD model to accurately simulate complex …
March 17, 2020 11:00 AM (EDT) Venue: Online In the automotive market revolution, new car assessment programs (NCAP) rate vehicle safety from one to five stars. The safety of ADAS equipment is now considered in the rating. To achieve the highest safety level (5 Stars), OEMS need to save time and cost by reducing the …
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March 17, 2020 11:00 AM (EDT) Venue: Online Several commercial space launch systems have been developed recently that use powerful and reusable liquid-fueled rockets, requiring engineers to understand how to extend the lifespan of reusable rocket stages. Structural fatigue and failure of these reusable stages is caused by sloshing of the liquid fuel and oxidizer …
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Tue, Mar 17, 2020 11:00 AM - 12:00 PM MDT ** Work email address required** ABSTRACT Presently, emulation and FPGA-based prototyping are essential verification and validation techniques for a SoC, ASIC designs and become irreplaceable in pre-silicon verification of Deep Learning Accelerator designs. Challenges of the multi-FPGA design setup like partitioning, multiplexing limited I/O interconnections …
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Tuesday, March 17, 2020 12:00 PM 1:00 PM ANSYS AIM can do a little bit of everything. Structural Thermal CFD EM Polymer extrusion What it can do, it does very well. This webinar covers a wide range of simulations available in ANSYS AIM and discuss the benefit of a easy to use Swiss army knife of …
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March 18-19, 2020 Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA 95054 About SNUG Your Global Design Community Focused on Innovation The Synopsys Users Group (SNUG) was established in 1991 to provide users of Synopsys design tools and technology with an open forum in which they could exchange ideas, discuss problems and …
March 18, 2020 11:30 AM (IST) Venue: Online With near-instant simulation capabilities and an extremely easy-to-use multiphysics interface, Ansys Discovery speeds up product design and development while reducing the number of physical prototypes needed. Through interactive design explorations, designers can now avoid unnecessary prototyping, hence saving time and money. Join us for this Ansys Webinar …
ACM International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems March 19 - 20, 2020 Monterey, California The ACM sponsored TAU series of workshops provide an informal forum for practitioners and researchers working on temporal aspects of digital systems to disseminate early work and engage in a free discussion of ideas. The twenty-seventh in …
Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot as the protocol of choice for low latency, high throughput chip-to-chip connectivity. SiFive is extending …
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