Learn from leading hardware security researchers & professionals and discuss the latest & most innovative research on attacking and defending hardware. Connect with industry peers. Join us for a bigger, …
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RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive. data center, space, IoT, embedded and more. Each day, thousands of engineers around the world collaborate and contribute to advance RISC-V. The RISC-V community shares the …
About It’s time for our annual CadenceCONNECT: Jasper User Group Conference - San Jose. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world …
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Become part of a global network of engineers developing innovative approaches and solutions that are shaping the future of the transportation industry! This two-day conference is free to attend and offers technical sessions and hands-on workshops. Registering for either or both conferences will allow you to access and attend any session. To register for the …
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WELCOME TO EDI CON ONLINE EDUCATIONAL DAYS EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand. New for 2024, EDI CON Educational Days will …
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The Future of Electronics RESHAPED Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, Wearable, Structural, and 3D. Join the flagship TechBlick event and the global industry in Berlin on 23-24 October 2024. This is where the latest updates are unveiled, where all the key conversations take place and where new …
Drive Growth and Boost Efficiency Leverage WIoT Technologies to Cut Costs and Enhance Your Business Performance The event caters to businesses of all sizes, from small startups to medium enterprises and large corporations, offering a rich program, dynamic exhibition, and much more for targeted networking, strategic growth opportunities, strong partners, products, and solutions that will …
Join this webinar to learn how to engage students in how tech solutions such as smog towers can contribute to a more sustainable future. Learn how the already created education resources can support easy implementation into your curriculum while retaining, engaging, and teaching your students about industry-standard tools. TIME: October 23, 2024 11 AM EDT …
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The International Conference on Computer-Aided Design focuses on advancements and research in the field of electronic design automation (EDA) and computer-aided design (CAD) for integrated circuits and systems. Topics include innovations in design methodologies, tools, algorithms, and technologies related to the development of electronic systems. Call for Papers Jointly sponsored by IEEE and ACM, ICCAD …
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Registration is now open for the 2024 National Semiconductor Technology Center (NSTC) Symposium and Microelectronics Commons Annual Meeting, which will feature three days of programming from U.S. microelectronics leaders from industry, academia, and government, including the Department of Commerce and the Department of Defense. Both events will offer exclusive insight into the achievements made through …
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Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects is still a new frontier. In the era of cloud computing, smart devices, and novel nano-scale devices, practitioners and researchers have to address new challenges …
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Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects is still a new frontier. In the era of cloud computing, smart devices, and novel nano-scale devices, practitioners and researchers have to address new challenges …
The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. The MICRO community has enjoyed a …
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About ITC International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and …
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was …
The APCCAS is a major international forum for researchers, scientists, educators, students and engineers to exchange their latest findings in circuits and systems. It covers a wide range of topics …
WISH | Women in Semiconductor Hardware is GSA WLI’s technical conference bringing together industry luminaries, entrepreneurs, and university women in STEM. This event will showcase the changing face of technology and offer new awards celebrating the women who have helped to break the glass ceiling and those who are following in their footsteps. Join our …
A must for anyone who is entering the medical market of wearables The world's biggest medical trade fair is the hotspot for wearable technologies in the healthcare segment where decision-makers from all over the world come together. At the WT | Wearables Technologies Joint Pavilion more than 45 exhibitors are showcasing which latest innovations and …
About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …
SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support to the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the …
Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder & Bulk Solids. This all-in-one, industry-wide event lets you explore the latest trends and technologies shaping the future in advanced design and manufacturing across automation, …
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The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …
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Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …
