NAFEMS Americas will be hosting its biennial regional conference on July 9-11, 2024, in Louisville, Kentucky, USA. The 2024 NAFEMS Americas Conference will bring together the leading visionaries, developers, and practitioners of CAE-related technologies in an open forum, unlike any other, to share experiences, discuss relevant trends, discover common themes, and explore future issues, including: What is the …
SEMICON West brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges through programs highlighting Market Intelligence | Standards | Sustainability | Workforce Development | SEMI University | Supply Chain Management | and much more! COLLECTIVELY SEMI member companies provide the equipment, materials, software, devices, and services that enable technologies to create a smarter world. JOINTLY we align and aggregate …
Ensuring reliable performance of products in the field requires verification and validation at the system level. This means considering the complex interaction of different physics between systems and sub-systems. In …
Whether you’re conducting safety analyses at the system, software, or hardware level, medini analyze can help you achieve: Up to 50% increased efficiency in your functional safety analyses, End-to-end traceability, including integration …
Continue reading "ISO 26262 Safety Analysis: Streamline Your Path to Functional Safety"
About The Conference We are delighted to announce the AESIN Conference 2024 to be held on 11th July. This year’s AESIN theme is Collaboration in a technology rich era. We …
Join us at Virtual Prototyping Day 2024 to hear about the latest deployed virtual prototyping innovations. This event highlights applications from around the world using the latest virtual prototyping technology, …
Description Today’s wireless and high-speed chip designs integrate an incredible amount of functionality on very small silicon real estate. Such integration requires optimization from the early stages of the design …
Continue reading "Webinar: Chip-Level Electromagnetic Crosstalk Signoff Using EMX Solver"
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
Today, we find ourselves at the nexus of the fourth industrial revolution — an era dominated by Smart Everything. The internet, artificial intelligence, and the use of software are helping …
The digital chip design flow carries with it an enormous wealth of untapped information regarding the health and status of your SoC design. The ability to efficiently mine this data …
Continue reading "Webinar: Maximize Productivity with Deep Insights into PPA Trajectories"
This webinar equips you with effective strategies to tackle randomization-related errors within your UVM verification environment. We'll explore the power of Cadence's Verisium Debug, a tool designed to simplify the …
Continue reading "Webinar: Efficient Way to UVM Constraint Randomization Debug"
Leveraging functional patterns is crucial for achieving high defect coverage and reducing defective parts per million (DPPM) levels. Synopsys VC Z01X fault simulator offers enhanced fault coverage in manufacturing test flows, complementing …
Continue reading "Webinar: Enhancing Manufacturing Test Flows with Synopsys VC Z01X"
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, …
Continue reading "Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update"
