We will introduce all the physics and system design that simulation can support when designing wind turbines. Learn how to engage students in engineering and design challenges and enhance their …
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One of the main draws of digital engineering to enable true digital transformation is using connected digital models to provide timely contextual engineering insight for decision-making. The new 2024 R2 versions of Ansys Minerva, ModelCenter, and STK take the idea of connectedness to the next level. These new features will enable Ansys ModelCenter and STK …
The 2024 Leaders in Simulation Summit Great ideas begin with people like you. Having the right solution at the right time can mean the difference between tabling thoughts or transforming industries. Ansys technologies puts the power of innovation in your hands. Step into the future of engineering at the Simulation Leaders Summit, where we celebrate …
Processor trace gives software developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. In this presentation, Siemens and Lauterbach will give an overview …
Employing innovative adaptive dual-solver technology, NanoSpice Pro X™ integrates the cutting-edge FastSPICE engine with the analog engine to deliver high accuracy and performance for memory circuits, CPUs, custom digital designs, SoCs, and full-chip mixed-signal applications. Featuring breakthrough capabilities like intelligent topology recognition, automated partitioning, and enhanced event-driven architecture. NanoSpice Pro X™ excels in RC reduction …
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This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, …
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The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic …
From Ideas to Impact The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from …
Last year the 70 year-old Tokyo Motor Show was reborn as the Japan Mobility Show, conceived to promote collaboration across industries through new partnerships working to create the mobility of …
Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and …
SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter …
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Become part of a European network of engineers developing innovative approaches and solutions shaping the future. The Ansys Innovation Conference, Germany brings together the renowned LS-DYNA forum and Digital Safety Conference into a larger cross- functional event. It is free to attend offers leading keynotes, customer-led technical sessions on the first conference day and technical …
This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi …
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The 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 at 𝗠𝗮𝗱𝗿𝗶𝗱 is an exclusive event where every engineer, researcher or scientist who uses or is interested in numerical simulation will find a unique experience focused on …
Discover the Future of HyperLynx Technology: Lunch and Learn Join us to be among the first to explore HyperLynx breakthrough technologies designed to redefine user experience and boost design productivity. …
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Learn from leading hardware security researchers & professionals and discuss the latest & most innovative research on attacking and defending hardware. Connect with industry peers. Join us for a bigger, …
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RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive. data …
About It’s time for our annual CadenceCONNECT: Jasper User Group Conference - San Jose. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal verification technologies and methodologies. This is an in-person conference. The Jasper User …
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Become part of a global network of engineers developing innovative approaches and solutions that are shaping the future of the transportation industry! This two-day conference is free to attend and offers technical sessions and hands-on workshops. Registering for either or both conferences will allow you to access and attend any session. To register for the …
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WELCOME TO EDI CON ONLINE EDUCATIONAL DAYS EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand. New for 2024, EDI CON Educational Days will …
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The Future of Electronics RESHAPED Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, Wearable, Structural, and 3D. Join the flagship TechBlick event and the global …
Drive Growth and Boost Efficiency Leverage WIoT Technologies to Cut Costs and Enhance Your Business Performance The event caters to businesses of all sizes, from small startups to medium enterprises and large corporations, offering a rich program, dynamic exhibition, and much more for targeted networking, strategic growth opportunities, strong partners, products, and solutions that will …
Join this webinar to learn how to engage students in how tech solutions such as smog towers can contribute to a more sustainable future. Learn how the already created education resources can support easy implementation into your curriculum while retaining, engaging, and teaching your students about industry-standard tools. TIME: October 23, 2024 11 AM EDT …
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The International Conference on Computer-Aided Design focuses on advancements and research in the field of electronic design automation (EDA) and computer-aided design (CAD) for integrated circuits and systems. Topics include innovations in design methodologies, tools, algorithms, and technologies related to the development of electronic systems. Call for Papers Jointly sponsored by IEEE and ACM, ICCAD …
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Registration is now open for the 2024 National Semiconductor Technology Center (NSTC) Symposium and Microelectronics Commons Annual Meeting, which will feature three days of programming from U.S. microelectronics leaders from industry, academia, and government, including the Department of Commerce and the Department of Defense. Both events will offer exclusive insight into the achievements made through …
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Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects is still a new frontier. In the era of cloud computing, smart devices, and novel nano-scale devices, practitioners and researchers have to address new challenges …
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Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects is still a new frontier. In the era of cloud computing, smart devices, and novel nano-scale devices, practitioners and researchers have to address new challenges …
The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. The MICRO community has enjoyed a …
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About ITC International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and …
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. Electronic System …
The APCCAS is a major international forum for researchers, scientists, educators, students and engineers to exchange their latest findings in circuits and systems. It covers a wide range of topics including, but not limited to the following： Artificial Intelligence Circuits, Systems, and Applications Digital Integrated Circuits and Systems Analog and Mixed Signal Circuits and Systems …
WISH | Women in Semiconductor Hardware is GSA WLI’s technical conference bringing together industry luminaries, entrepreneurs, and university women in STEM. This event will showcase the changing face of technology and offer new awards celebrating the women who have helped to break the glass ceiling and those who are following in their footsteps. Join our …
A must for anyone who is entering the medical market of wearables The world's biggest medical trade fair is the hotspot for wearable technologies in the healthcare segment where decision-makers …
About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …
SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support to the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the …
Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder & Bulk Solids. This all-in-one, industry-wide event lets you explore the latest trends and technologies shaping the future in advanced design and manufacturing across automation, …
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The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …
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Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …
