Webinar: Avoid Costly Silicon Respins: Maximize Reliability and Yield with Advanced Noise and Binning Modeling

Online

Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and Modeling Accurately accounting for noise is essential for ensuring reliability of complex semiconductor devices. Explore how noise data across the wafer serves as an early …

Webinar: Spec-Driven Modeling Automation Platform SDEP™

Online

SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter extraction, and model quality checking. With its flexible GUI and flow control capabilities, SDEP™ enables modeling engineers to efficiently build and customize workflows, automate routine …

Ansys Innovation Conference, Germany

Germany , Germany

Become part of a European network of engineers developing innovative approaches and solutions shaping the future. The Ansys Innovation Conference, Germany brings together the renowned LS-DYNA forum and Digital Safety Conference into a larger cross- functional event. It is free to attend offers leading keynotes, customer-led technical sessions on the first conference day and technical …

Packaging Chips with CHIPS: West Coast Summit

Skysong at ASU’s Scottsdale Innovation Center Skysong 1 1475 North Scottsdale Road, Scottsdale, AZ, United States

This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in …

Discover the Future of HyperLynx Technology: Lunch and Learn

Siemens Fremont Office 46897 Bayside Pkwy #200, Fremont, CA, United States

Discover the Future of HyperLynx Technology: Lunch and Learn Join us to be among the first to explore HyperLynx breakthrough technologies designed to redefine user experience and boost design productivity. Released in September 2024, these innovations are tailored to address the most pressing challenges faced by design engineers, helping you stay ahead in a competitive …

Hardwear.io Security Trainings and Conference Netherlands 2024

Amsterdam Marriott Hotel Stadhouderskade 12, Amsterdam, Netherlands

Learn from leading hardware security researchers & professionals and discuss the latest & most innovative research on attacking and defending hardware. Connect with industry peers. Join us for a bigger, bolder, and better hardwear.io. ARE YOU READY FOR HARDWEAR.IO Netherlands 2024? In the past couple of months our goal was to knuckle down and build …

RISC-V Summit 2024

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive. data center, space, IoT, embedded and more. Each day, thousands of engineers around the world collaborate and contribute to advance RISC-V. The RISC-V community shares the …

Ansys Transportation Summit and International LS-DYNA User Conference

St. John’s Resort 44045 Five Mile Road, Plymouth, MI, United States

Become part of a global network of engineers developing innovative approaches and solutions that are shaping the future of the transportation industry! This two-day conference is free to attend and offers technical sessions and hands-on workshops.​ Registering for either or both conferences will allow you to access and attend any session. To register for the …

TechBlick Europe 2024

Estrel Berlin Hotel and Convention Center (ECC) Sonnenallee 225, Berlin, Germany

The Future of Electronics RESHAPED Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Join the flagship TechBlick event and the global …

Wireless IoT Tomorrow 2024

RheinMain CongressCenter Friedrich-Ebert-Allee 1, Wiesbaden, Germany

Drive Growth and Boost Efficiency Leverage WIoT Technologies to Cut Costs and Enhance Your Business Performance The event caters to businesses of all sizes, from small startups to medium enterprises …

2024 ACM/IEEE International Conference on Computer-Aided Design

Newark Liberty International Airport Marriott 1 Hotel Rd, Newark, NJ, United States

The International Conference on Computer-Aided Design focuses on advancements and research in the field of electronic design automation (EDA) and computer-aided design (CAD) for integrated circuits and systems. Topics include innovations in design methodologies, tools, algorithms, and technologies related to the development of electronic systems. Call for Papers Jointly sponsored by IEEE and ACM, ICCAD …

2024 National Semiconductor Technology Center (NSTC) Symposium

Omni Shoreham Hotel 2500 Calvert St NW, Washington, DC, United States

Registration is now open for the 2024 National Semiconductor Technology Center (NSTC) Symposium and Microelectronics Commons Annual Meeting, which will feature three days of programming from U.S. microelectronics leaders from industry, academia, and government, including the Department of Commerce and the Department of Defense. Both events will offer exclusive insight into the achievements made through …

The International Workshop on Hardware and Architectural Support for Security and Privacy (HASP) 2024

AT&T Hotel and Conference Center 1900 University Avenue, Austin, TX, United States

Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects is still a new frontier. In the era of cloud computing, smart devices, and novel nano-scale devices, practitioners and researchers have to address new challenges …

MICRO 2024 (57th IEEE/ACM International Symposium on Microarchitecture®)

AT&T Hotel and Conference Center 1900 University Avenue, Austin, TX, United States

The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in …

Phil Kaufman Award Ceremony & Banquet

Hayes Mansion 200 Edenvale Ave, San Jose, CA, United States

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. Electronic System …

APCCAS 2024

CHANG YUNG-FA FOUNDATION International Convention Center (CYFF) No.11, Zhongshan S. Rd., Taipei City, Taiwan

The APCCAS is a major international forum for researchers, scientists, educators, students and engineers to exchange their latest findings in circuits and systems. It covers a wide range of topics including, but not limited to the following: Artificial Intelligence Circuits, Systems, and Applications Digital Integrated Circuits and Systems Analog and Mixed Signal Circuits and Systems …

WISH – Women in Semiconductor Hardware

San Jose McEnery Convention Center 150 W San Carlos St, San Jose, CA, United States

WISH | Women in Semiconductor Hardware is GSA WLI’s technical conference bringing together industry luminaries, entrepreneurs, and university women in STEM. This event will showcase the changing face of technology and offer new awards celebrating the women who have helped to break the glass ceiling and those who are following in their footsteps. Join our …

WT | The Wearable Technologies Show 2024

Düsseldorf, Germany Düsseldorf, Germany

A must for anyone who is entering the medical market of wearables The world's biggest medical trade fair is the hotspot for wearable technologies in the healthcare segment where decision-makers from all over the world come together. At the WT | Wearables Technologies Joint Pavilion more than 45 exhibitors are showcasing which latest innovations and …

SEMICON Europa 2024

Messe Munchen Munich, Germany

SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support to the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the …

Advanced Design & Manufacturing Montréal 2024

Palais des congrès de Montréal 1001 Place Jean-Paul-Riopelle, Montréal, Québec, Canada

Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder & Bulk Solids. This all-in-one, industry-wide event lets you explore the latest trends and technologies shaping the future in advanced design and manufacturing across automation, …

TSMC Open Innovation Platform® Ecosystem Forum 2024 – China

Hyatt Regency Beijing Wangjing 8 Guangshun South Street, Beijing, China

The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …

Advanced Packaging Conference (APC) 2024

Messe Munchen Munich, Germany

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …