Ensuring reliable performance of products in the field requires verification and validation at the system level. This means considering the complex interaction of different physics between systems and sub-systems. In …
Whether you’re conducting safety analyses at the system, software, or hardware level, medini analyze can help you achieve: Up to 50% increased efficiency in your functional safety analyses, End-to-end traceability, including integration …
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About The Conference We are delighted to announce the AESIN Conference 2024 to be held on 11th July. This year’s AESIN theme is Collaboration in a technology rich era. We …
Join us at Virtual Prototyping Day 2024 to hear about the latest deployed virtual prototyping innovations. This event highlights applications from around the world using the latest virtual prototyping technology, …
Description Today’s wireless and high-speed chip designs integrate an incredible amount of functionality on very small silicon real estate. Such integration requires optimization from the early stages of the design to post-layout vs. schematic (LVS) signoff. Increasingly complex designs and advanced process nodes test the limits of electromagnetic (EM) solvers in terms of modeling capacity …
Continue reading "Webinar: Chip-Level Electromagnetic Crosstalk Signoff Using EMX Solver"
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …
Today, we find ourselves at the nexus of the fourth industrial revolution — an era dominated by Smart Everything. The internet, artificial intelligence, and the use of software are helping to create things that couldn’t even be imagined just a decade or two ago. The opportunities seem limitless, and the potential for more world-changing technologies …
The digital chip design flow carries with it an enormous wealth of untapped information regarding the health and status of your SoC design. The ability to efficiently mine this data …
Continue reading "Webinar: Maximize Productivity with Deep Insights into PPA Trajectories"
This webinar equips you with effective strategies to tackle randomization-related errors within your UVM verification environment. We'll explore the power of Cadence's Verisium Debug, a tool designed to simplify the debugging process. What You Will Learn Practical techniques for isolating and resolving randomization-related errors Optimize your UVM verification environment for robust functionality Gain valuable insights …
Continue reading "Webinar: Efficient Way to UVM Constraint Randomization Debug"
Leveraging functional patterns is crucial for achieving high defect coverage and reducing defective parts per million (DPPM) levels. Synopsys VC Z01X fault simulator offers enhanced fault coverage in manufacturing test flows, complementing ATPG tools like Synopsys TestMAX ATPG. In this presentation we will delve into unique coverage scenarios, such as resets and clocks blocked during ATPG mode. We'll …
Continue reading "Webinar: Enhancing Manufacturing Test Flows with Synopsys VC Z01X"
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …
Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities. TIME: JULY 18, 2024 11 AM EDT Venue: Virtual Overview This Ansys 2024 R2 webinar reviews the updates, enhancements, and new features …
Continue reading "Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update"
Welcome to Nuclear & Space Radiation Effects Conference On behalf of the Institute of Electrical and Electronics Engineers (IEEE), its Nuclear and Plasma Sciences Society (NPSS), the Radiation Effects Steering Group (RESG) and the 2024 Nuclear and Space Radiation Effects Conference (NSREC) committee and volunteers, it is my pleasure to invite you to attend the …
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Every two years, the aerospace, aviation and defence industries are invited to Farnborough International Exhibition & Conference Centre for the world’s best airshow to pioneer change, build new connections, engage with thought leaders and get access to unparalleled business development opportunities. The Farnborough International Airshow remains the leader in connecting the world of aerospace, hosting …
Conference introduction Digital transformation is happening at an unprecedented pace, are you involved? How to move from simply discovering problems to solving them in real time? How can you improve your daily operations to meet and exceed your goals? How to innovate faster to solve the toughest business challenges? Whether you simply want to do …
About this event As electronics grow denser and interconnects more intricate, the design process becomes increasingly challenging. Designers need increased automation and cross-functional collaboration to adhere to stringent industry standards. …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …
This webinar covers how Ansys solutions address battery management challenges and complexities: model-based functional safety analysis and safety-critical BMS software development, BMS integration, and validation. TIME: JULY 31, 2024 9 …
Continue reading "Webinar: ISO-26262 Compliant BMS and Vehicle Integration"
09:00 am – 10:30 am CST (UTC+8), Thursday, August 1 Meet the Industry Experts from TSMC Organizations Get an inside look on the world’s largest semiconductor foundry Have a chance to raise your questions As one of the world's leading semiconductor companies, TSMC is at the forefront of innovation and development in this field. This event …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …
During the 38th Annual Small Satellite Conference, we will explore how automation is being integrated into small satellite systems across the space, launch, ground, and user segments, making them smarter and more effective. Keynote Speakers Monday, August 5 at 1:00 PM MT Mr. Steve Isakowitz President and CEO of The Aerospace Corporation View Bio Tuesday, …
Overview The AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) featuring the 11th International Atomic Layer Etching Workshop (ALE 2024) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe …
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Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
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FMS: the Future of Memory and Storage has expanded the scope of Flash Memory Summit to encompass all tiers of Memory and Storage. As a leading global independent conference and exhibition, …
About The SMD Symposium is the leading educational, professional development and networking event in the space and missile defense community. The symposium is widely attended by leaders and professionals from …
The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. To combat the complexity and sheer intricacy of semiconductor manufacturing, innovative software solutions are required. Synopsys Fab.da is a comprehensive process control solution that utilizes artificial intelligence (AI) …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …
