Welcome to the two (2) day, 13th Annual Hybrid Riscure workshop on September 3 & 4th 2020. The event is will focus on topics relevant to embedded security. The delivery …
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GENERAL INFORMATION The 2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2) is the 22nd, "rebooted" edition of the System-Level Interconnect Prediction (SLIP) Workshop. As computing systems and applications grapple …
About the Event Join Altair’s high-performance and high-throughput computing experts, along with our partners, technology users, and industry peers, for a virtual summit exploring the leading-edge enterprise computing solutions that …
The major annual event of the Israeli semiconductor industry ChipEx2020 is the largest annual event of the Israeli semiconductor industry. This year, due to the Covid 19 crisis, we decided to do …
A Virtual Event 22-23 September | 07:00-11:00 PDT MIPI DevCon will be offering its previously scheduled Osaka event virtually 22-23 September 2020, to ensure that developers continue to have access …
Achieve Silicon-to-System Success at IDEAS Digital Forum September 23-24, 2020 Ansys is at the forefront of semiconductor enablement in partnership with the world’s leading companies for AI and machine learning, …
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ACCELERATING THE DIGITAL FUTURE INNOVATING & COLLABORATING TOGETHER On behalf of our CEO Dr. Tom Caulfield and the rest of our GF team, we are excited to invite you to …
THE WORLD’S LEADING EDGE COMPUTING EVENT- LIVE ONLINE ! The Only Event That Brings Together the Entire Edge Ecosystem with Developers and Users to Drive Forward the Next Evolution of …
For more than a decade, The Linley Group has delivered the industry’s premier processor conference. This year, the Linley Fall Processor Conference will feature virtual presentations that run half days …
Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die …
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This period of pandemic and confinement has fostered telework and remote relationships. As a result, data transfers around the world have increased dramatically. During its annual Devices Workshop, CEA-Leti will …
PISCATAWAY, NJ (June 24, 2020) –The organizers of the upcoming 66th annual IEEE International Electron Devices Meeting (IEDM), the world’s premier forum for technological breakthroughs in semiconductor and electron device …
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As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power …
Digitally, too, it is THE world’s meeting point for the printed electronics sector: LOPEC. In 2021 for the first time, it will be held fully online. LOPEC—short for Large-area, Organic …
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