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RAAAM Memory Technologies ay the 2024 Design Automation Conference

RAAAM Memory Technologies ay the 2024 Design Automation Conference
by Daniel Nenni on 06-19-2024 at 12:00 pm

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This is the first year that RAAAM is attending DAC and presenting its revolutionary on-chip memory technology. Remember, DAC is the #1 EDA networking event where new technologies are often launched and this is one of many examples for #DAC2024.

Modern chips in various applications, such as Artificial Intelligence (AI) and Machine Learning (ML), Augmented / Virtual Reality (AR/VR), Automotive, 5G, High performance compute in data centres, etc., require ever-growing amounts of on-chip memory (SRAM) to meet the necessary performances under AI workloads. As a result, the amount of SRAM on almost any chip accounts for over 50% of the chip size. Furthermore, Moore’s Law has ended for SRAM, which no longer scales in advanced CMOS process nodes, resulting in limited on-chip memory capacities and significant cost increase for fabrication.

RAAAM’s GCRAM is the most cost-effective on-chip memory technology in the semiconductor industry, providing up-to 50% silicon area reduction and up-to 10X reduced power consumption over SRAM, and it is fully compatible with the standard CMOS fabrication flow, requiring no additional process steps or cost. RAAAM’s patented technology, an outcome of over a decade of R&D efforts, enables the extension of Moore’s Law for on-chip memories and can be used by semiconductor companies as a drop-in replacement for SRAM in their chips.

RAAAM’s GCRAM will allow customers to significantly reduce their chip cost and power consumption, or alternatively double the on-chip memory capacity with no extra cost, significantly reducing 1000X more the power-consumed due to off-chip memory accesses.

RAAAM’s GCRAM was implemented in various process nodes of leading foundries and full technology qualification is performed based on customers’ demand. 5nm and 16nm solutions are in the commercialization phase and migration to additional process technologies will be implemented during 2025.

RAAAM is one of the many companies participating in this industry-leading event, and you are invited to meet our team on the exhibit floor. We look forward to explore how GCRAM technology can help your product. Please contact RAAAM Here to schedule a meeting at booth #1460. I hope to see you there!

About DAC

DAC is recognized as the global event for chips to systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM’s Special Interest Group on Design Automation (SIGDA) and IEEE’s Council on Electronic Design Automation (CEDA).

About RAAAM Memory Technologies

RAAAM has developed the most cost-effective on-chip memory technology in the semiconductor industry, providing 50% area reduction over high-density SRAM and reduced power consumption by a factor of five. RAAAM’s patented technology can be used by semiconductor companies as a drop-in replacement for SRAM in their SoCs and can be manufactured cost efficiently using the standard CMOS process allowing to significantly reduce the die size. Founded in 2021, the company is headquartered in Israel with R&D center in Switzerland.

Also Read:

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Perforce at the 2024 Design Automation Conference

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