Anyone who has read my previous articles about IEDM knows I consider it the premier conference on process technology.
Last year due to COVID IEDM was virtual and although virtual offers some advantages the hallway conversations that can be such an important part of the conference are lost. This year IEDM is returning as a live event in San Francisco from Dec. 11-15, 2020, with on-demand access to materials starting Dec. 17.
Saturday, December 11 will be the tutorials:
90-Minute Tutorials – Saturday, Dec. 11
The 90-minute Saturday tutorial sessions on emerging technologies have become a popular and growing part of the IEEE IEDM. They are presented by experts in the field to bridge the gap between textbook-level knowledge and leading-edge current research, and to introduce attendees to new fields of interest:
2:45 p.m. – 4:15 p.m.
- Beyond the FinFET Era: Challenges and Opportunities for CMOS Technology, Kai Zhao, IBM
- TCAD-Based DTCO and STCO, Asen Asenov, University of Glasgow
- 6G Technology Challenges from Devices to Wireless Systems, Aarno Pärssinen, Oulu University
4:30 p.m. – 6:00 p.m.
- Selective and Atomic-Scale Processes for Advanced Semiconductor Manufacturing, Robert Clark, TEL
- Machine Learning for Semiconductor Device and Circuit Modeling, Elyse Rosenbaum, University of Illinois, Urbana-Champaign
- GaN Power Device Technology and Reliability, Dong Seup Lee, Texas Instruments
Sunday, December will be the short courses:
IEDM Short Courses – Sunday, Dec. 12
In contrast to the Tutorials, the full-day Short Courses are focused on a single technical topic. Early registration is recommended, as they are often sold out. They offer the opportunity to learn about important areas and developments, and to network with global experts.
- Future Scaling and Integration Technology, organized by Dechao Guo, IBM Research
- Processes and Materials Engineering Innovations for Advanced Logic Transistor Scaling, Benjamin Colombeau, Applied Materials
- Interconnect Resistivity: New Materials, Daniel Gall, Rensselaer Polytechnic Institute
- Metrology and Material Characterization for the Era of 3D Logic and Memory, Roy Koret, Nova Ltd.
- Beyond FinFET Devices: GAA, CFET, 2D Material FET, Chung-Hsun Lin, Intel
- Heterogenous Integration Using Chiplets & Advanced Packaging, Madhavan Swaminathan, Georgia Tech
- Design-Technology Co-Optimization/System-Technology Co-Optimization, Victor Moroz, Synopsys
- Emerging Technologies for Low-Power Edge Computing, organized by Huaqiang Wu, Tsinghua University and John Paul Strachan, Forschungszentrum Jülich
- Mobile NPUs for Intelligent Human/Computer Interaction, Hoi-Jun Yoo, KAIST
- Brain-Inspired Strategies for Optimizing the Design of Neuromorphic Sensory-Processing Systems, Giacomo Indiveri, University of Zurich
- Memory-Based AI & Data Analytics Solutions, Euicheol Lim, SK hynix
- Material Strategies for Memristor-Based AI Hardware and their Heterointegration, Jeehwan Kim, MIT
- RRAM Devices for Data Storage and In-Memory Computing, Wei Lu, University of Michigan
Practical Implementation of Wireless Power Transfer, Hubregt Visser, IMEC
Monday will begin the conference with the plenary talks:
Plenary Presentations – Monday, Dec. 13
- The Smallest Engine Transforming Our Future: Our Journey Into Eternity Has Only Begun, Kinam Kim, Vice Chairman & CEO, Samsung Electronics Device Solutions Division
- Creating the Future: Augmented Reality, the Next Human-Machine Interface, Michael Abrash, Chief Scientist, Facebook Reality Labs
- Quantum Computing Technology, Heike Riel, Head of Science & Technology, IBM Research and IBM Fellow
Followed by the full conference Monday through Thursday.
As every year, IEEE IEDM 2021 will offer Special Focus Sessions on emerging topics with invited talks from world experts to highlight the latest developments.
Monday, December 13, 1:35 PM
Session 3 – Advanced Logic Technology – Focus Session – Stacking of devices, circuits, chips: design, fabrication, metrology – challenges and opportunities
Tuesday, December 14, 9:05 AM
Session 14 – Emerging Device and Compute Technology – Focus Session – Device Technology for Quantum Computing
Wednesday, December 15, 9:05 AM
Session 25 – Memory Technology/Advanced Logic Technology – Focus Session – STCO for memory-centric computing and 3D integration
Wednesday, December 15, 1:35 PM
Session 35 – Sensors, MEMS, and Bioelectronics/Optoelectronics, Displays, and Imaging Systems – Focus Session – Technologies for VR and Intelligence Sensors
Session 38 – Emerging Device and Compute Technology/Optoelectronics, Displays, and Imaging Systems – Focus Session – Topological Materials, Devices, and Systems
For more information and to access the full program as it becomes available, please go to: https://www.ieee-iedm.org/
IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.
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