Anyone who has read my previous articles about IEDM knows I consider it the premier conference on process technology.
Last year due to COVID IEDM was virtual and although virtual offers some advantages the hallway conversations that can be such an important part of the conference are lost. This year IEDM is returning as a live event… Read More
In 2008, Mubadala, the Abu Dhabi government owned sovereign wealth fund assisted AMD in divesting their manufacturing assets and spinning them off. They were compensated with a combination of direct payments, investments in AMD, and shares in the new firm, GlobalFoundries. The divestiture was a multi-year journey, but by 2012,… Read More
The field of DRAM is fascinating as it continues to grow and innovate. For the past ten years, I have often read that DRAM is running out of steam because of its difficulty to scale the capacitor, and yet it continues to evolve since invented by Dr. R. Dennard at IBM. In 1966, he introduced the concept of a transistor memory cell consisting… Read More
Intel presented yesterday on their plans for process technology and packaging over the next several years. This was the most detailed roadmap Intel has ever laid out. In this write up I will analyze Intel’s process announcement and how they match up with their competitors.
10nm Super Fin (SF)
10nm is now in volume production in three… Read More
At the 2021 VLSI Technology Symposium, Imec presented on Ruthenium (Ru) and Molybdenum (Mo) as alternate Word Line (WL) materials for 3D NAND Flash “First Demonstration of Ruthenium and Molybdenum Word lines Integrated into 40nm Pitch 3D NAND Memory Devices”. I had an opportunity to interview one of the authors: Maarten Rosmeulen.… Read More
While there is a lot of excitement around the semiconductor shortage narrative and the fabs all being full, both 200mm and 300mm, there is one big plot hole and that is the FinFET era.
Intel ushered in the FinFET era only to lose FinFET dominance to the foundries shortly thereafter. In 2009 Intel brought out a 22nm FinFET wafer at the… Read More
The annual Siemens Digital Industries Software user group event was held virtually on May 26th, which made it easy to attend from my home office, although selecting from the list of speakers was a challenge, because they offered 475 sessions, wow. My focus is EDA, so I listened to Joseph Sawicki, the Executive Vice President, IC … Read More
IBM has announced the development of a 2nm process.
What was announced:
- 50 billion transistors in a “thumbnail” sized area later disclosed to be 150mm2 = 333 million transistors per millimeter (MTx/mm2).
- 44nm Contacted Poly Pitch (CPP) with 12nm gate length.
- Gate All Around (GAA), there are several ways
… Read More
At the SPIE Advanced Lithography Conference in February 2021, Regina Freed of Applied Materials gave a paper: “Module-Level Material Engineering for Continued DRAM Scaling”. Applied Materials provided me with the presentation and was kind enough to set up an interview for me with Regina Freed.
I also spoke to Regina Freed last… Read More
There are a lot of articles out right now discussing a possible IPO for Kioxia or sale of the company with Western Digital (WD) and Micron Technology (MT) mentioned as possible acquirers. Kioxia and WD have a partnership for Flash Memory and on March 18th WD gave a presentation on the state of their partnership and what they see as their… Read More