WEBINAR – Advanced Semiconductor Packaging: Leading Patent Owners and New Entrants

Since 2016, KnowMade has been researching and monitoring the intellectual property (IP) landscape related to advanced semiconductor packaging, including fan-out WLP, 2.5D packaging, and 3D SoC. Propelled by high-performance computing and emerging applications, a tremendous number of inventions have been published in recent years. While historical players have expanded their patent portfolios, new entrants have recently joined the patent landscape with a blooming IP activity. This webinar will provide an overview of the patenting activity trends for fan-out packaging, interposers, embedded interconnect bridges, and hybrid bonding. We will compare the IP leadership of main players and discuss recent IP developments.