Webinar: Accurate PCB Reliability Predictions for Thermal Cycling

Electronics that are exposed to fluctuating temperatures undergo a process known as thermal cycling. These fluctuations in temperature cause the PCB and it’s components to expand and contract with the rise and fall of temperature. The various materials used electronics will expand and contract at different rates due to a mismatch in the coefficient of thermal expansion, which leads to mechanical stresses in the solder joints. Over time, these stresses can cause cracks to form in the solder joints that will compromise the connectivity and integrity of the PCB. Understanding the temperature distribution of the PCB under real-world operating conditions is critical for accurate reliability predictions due to thermal cycling. Incorporating thermal analysis early in the design process allows engineers to use accurate temperature distributions when making reliability predictions.

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