IMAPS 2024
September 30 - October 3
Our Jam-Packed Annual Symposium
The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.
Our event kicks off with Professional Development Courses, followed by 3 days of technical sessions with emphasis on Design, Modeling and Manufacturing; Fanout, RDL, WLP / PLP; High Performance / High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology).
All Symposium sessions will take place at the Encore Boston Harbor where there is a discounted hotel room block.
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