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Ansys 2024 R1: High Frequency Electronics What’s New
April 9 @ 8:00 AM - 9:00 AM
Learn about the latest improvements and new features to the high frequency electronics simulation tools. There are many enhancements for engineers involved in RF, automotive, A&D, and consumer electronics designs that our subject matter experts will discuss.
TIME:
APRIL 9, 2024
11 AM EDT / 5 PM CEST / 8:30 PM IST
Venue:
Virtual
Overview
This Ansys 2024 R1 webinar will review the high-frequency electronics tool updates, enhancements, and new features – HFSS, Q3D, SIwave, and NuHertz. Engineers developing PCBs, antennas, and other RF capabilities for telecommunications, HPC, automotive, A&D, and IoT applications will find many new capabilities and improvements in this update.
What you will learn
- Encrypted technology file support in HFSS 3D Layout IC Mode
- Enhanced support for FlexPCB in HFSS 3D
- HFSS Finite Array metadata export and mask automation
- Icepak Thermal Mesh Fusion
- Solver enhancements for SIwave and Q3D
- Improvements to HPC/Distributed Computing support for all products
Who should attend and why
Engineers involved in new product development for any electronics market
Speaker
- Juliano Mologni
Semiconductors Slowing in 2025