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Synopsys IP Designs Edge AI 800x100
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TCAD Update from Synopsys

TCAD Update from Synopsys
by Daniel Payne on 11-03-2025 at 10:00 am

TCAD importance min

We live in an exploding AI world, and this has put pressure on foundries to deliver new products faster than ever before. Any help to accelerate the semiconductor R&D goes a long way to make the life of Fab engineers easier. EDA tools in the TCAD (Technology Computer Aided Design) category are critical for TCAD engineers to accelerating… Read More


Synopsys and NVIDIA Forge AI Powered Future for Chip Design and Multiphysics Simulation

Synopsys and NVIDIA Forge AI Powered Future for Chip Design and Multiphysics Simulation
by Daniel Nenni on 11-03-2025 at 6:00 am

Synopsys Nvidia Agentic AI 2025

In a landmark announcement at NVIDIA’s GTC Washington, D.C. conference Synopsys unveiled deepened collaborations with NVIDIA to revolutionize semiconductor design and engineering through agentic AI, GPU-accelerated computing, and AI-driven physics simulations. This partnership, building on over three decades… Read More


Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys

Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys
by Daniel Nenni on 10-31-2025 at 10:00 am

Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More


Chiplets: Powering the Next Generation of AI Systems

Chiplets: Powering the Next Generation of AI Systems
by Kalar Rajendiran on 10-23-2025 at 10:00 am

Arm Synopsys at Chiplet Summit

AI’s rapid expansion is reshaping semiconductor design. The compute and I/O needs of modern AI workloads have outgrown what traditional SoC scaling can deliver. As monolithic dies approach reticle limits, yields drop and costs rise, while analog and I/O circuits gain little from moving to advanced process nodes. To sustain … Read More


The Rise, Fall, and Rebirth of In-Circuit Emulation: Real-World Case Studies (Part 2 of 2)

The Rise, Fall, and Rebirth of In-Circuit Emulation: Real-World Case Studies (Part 2 of 2)
by Lauro Rizzatti on 10-20-2025 at 6:00 am

The Rise, Fall, and Rebirth of In Circuit Emulation real world case studies figure 1

Recently, I had the opportunity to speak with Synopsys’ distinguished experts in speed adapters and in-circuit emulation (ICE). Many who know my professional background see me as an advocate for virtual, transactor-based emulation, hence I was genuinely surprised to discover the impressive results achieved by today’s speed… Read More


Statically Verifying RTL Connectivity with Synopsys

Statically Verifying RTL Connectivity with Synopsys
by Bernard Murphy on 10-15-2025 at 6:00 am

TestMAX Advisor Use Model min

Many years ago, not long after we first launched SpyGlass, I was looking around for new areas where we could apply static verification methods and was fortunate to meet Ralph Marlett, a guy (now friend) with extensive experience in DFT. Ralph joined us and went on to build the very capable SpyGlass DFT app. So capable that SpyGlass… Read More


Why Choose PCIe 5.0 for Power, Performance and Bandwidth at the Edge?

Why Choose PCIe 5.0 for Power, Performance and Bandwidth at the Edge?
by Kalar Rajendiran on 10-14-2025 at 6:00 am

PCIe 5.0 Impact Across Markets

Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More


Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation

Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation
by Daniel Nenni on 10-01-2025 at 10:00 am

UNDER EMBARGO 1PM PT Sept 24 Synopsys TSMC OIP 2025 (1)

In a rapidly evolving semiconductor landscape, where AI demands unprecedented computational power and efficiency, Synopsys has deepened its partnership with TSMC to pioneer advancements in AI-driven designs and multi-die systems. Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages … Read More


AI Everywhere in the Chip Lifecycle: Synopsys at AI Infra Summit 2025

AI Everywhere in the Chip Lifecycle: Synopsys at AI Infra Summit 2025
by Kalar Rajendiran on 09-30-2025 at 10:00 am

Godwin Talk Summary AI Infra Summit 2025

At the AI Infra Summit 2025, Synopsys showed how artificial intelligence has become inseparable from the process of creating advanced silicon. The company’s message was clear: AI is an end-to-end engine that drives every phase of chip development. Three Synopsys leaders illustrated this from distinct vantage points. Godwin… Read More


Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions

Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
by Daniel Nenni on 09-29-2025 at 6:00 am

synopsys tsmc oip 2025 leading the next wave of ai and multi die innovation for tsmc advanced node designs

Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More