SiC 800 Jan2025Deadline Static
WP_Term Object
(
    [term_id] => 14433
    [name] => X-Subscriber
    [slug] => x-subscriber
    [term_group] => 0
    [term_taxonomy_id] => 14433
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 0
    [filter] => raw
    [cat_ID] => 14433
    [category_count] => 0
    [category_description] => 
    [cat_name] => X-Subscriber
    [category_nicename] => x-subscriber
    [category_parent] => 0
    [is_post] => 
)

Webinar on TFT and FPD Design

Webinar on TFT and FPD Design
by Daniel Payne on 05-11-2017 at 12:00 pm

I knew that the acronym for TFT meant Thin Film Transistors, but I hadn’t heard that FPD stands for Flat Panel Detectors. It turns out the FPD are solid-state sensors used in x-ray applications, similar in operation to image sensors for digital photography and video. I’ll be attending and blogging about what I learn… Read More


Achieving Requirements Traceability from Concept through Design and Test

Achieving Requirements Traceability from Concept through Design and Test
by Daniel Payne on 05-09-2017 at 12:00 pm

Excel is a wonderful, general purpose spreadsheet tool that lets me organize and analyze rows and columns of data into something meaningful, however it doesn’t know anything about requirements traceability for complex semiconductor projects. So why do so many engineering teams still rely upon Excel or custom, in-house… Read More


Noise, The Need for Speed, and Machine Learning

Noise, The Need for Speed, and Machine Learning
by Riko Radojcic on 05-08-2017 at 7:00 am

Technology trends make the concerns with electronic noise a primary constraint that impacts many mainstream products, driving the need for “Design-for-Noise” practices. That is, scaling, and the associated reduction in the device operating voltage and current, in effect magnifies the relative importance of non-scalableRead More


Webinar – Next Generation DDRM Needs, Solutions

Webinar – Next Generation DDRM Needs, Solutions
by Bernard Murphy on 05-02-2017 at 7:00 am

I’m a believer in product life-cycle management (PLM) for semiconductor design. It’s not an attention-grabbing topic like faster verification or improved PPA in implementation, but now massive IP-based design is routine, IP’s are sourced from multiple suppliers each cycling though multiple revisions and now that design … Read More


An Overview of Jama Software in the Semiconductor Industry

An Overview of Jama Software in the Semiconductor Industry
by Daniel Payne on 05-01-2017 at 12:00 pm

Portland, Oregon is a hotbed of innovation for software development companies and I tend to scan the headlines of my local newspaper the Oregonian, which is where I first started to read about Jama Software a few years back. Curiosity and opportunity drove me to meet with Trevor Smith of Jama in their Portland office. We chatted for… Read More


Approaches for EM, IR and Thermal Analysis of ICs

Approaches for EM, IR and Thermal Analysis of ICs
by Daniel Payne on 04-26-2017 at 12:10 pm

As an engineer I’ve learned how to trade off using various EDA tools based on the accuracy requirements and the time available to complete a project. EDA vendors have been offering software tools to help us with reliability concerns like EM, IR drop and thermal analysis for several years now. Last week I attended a webinar … Read More


NetSpeed Taking a Ride with Autonomous Automobiles

NetSpeed Taking a Ride with Autonomous Automobiles
by Mitch Heins on 04-24-2017 at 12:00 pm

The push for autonomous automobiles continues at a rapid pace. Last week a new conference was held in Santa Clara, CA by the Linley Group focused on Autonomous Hardware. The group included presentations from GLOBAL FOUNDRIES, Synopsys, NetSpeed Systems, Arteris, EMBC, Cadence, CEVA, ARM and Trilumina covering ADAS and autonomous… Read More


The Importance of EM, IR and Thermal Analysis for IC Design – Webinar

The Importance of EM, IR and Thermal Analysis for IC Design – Webinar
by Daniel Payne on 04-17-2017 at 4:00 pm

Designing an IC has both a logical and physical aspect to it, so while the logic in your next chip may be bug-free and meet the spec, how do you know if the physical layout will be reliable in terms of EM (electro-migration), IR (voltage drops) and thermal issues? EDA software once again comes to our rescue to perform the specific type… Read More


Synchronizing Collaboration

Synchronizing Collaboration
by Bernard Murphy on 04-12-2017 at 7:00 am

Much though some of us might wish otherwise, distributed development teams are here to stay. Modern SoC design requires strength and depth in expertise in too many domains to effectively source from one site; competitive multi-national businesses have learned they can very effectively leverage remote sites by building centers… Read More


When Once is Not Enough, But Unlimited is Too Much

When Once is Not Enough, But Unlimited is Too Much
by Tom Simon on 04-04-2017 at 12:00 pm

When people think about non volatile memory, the first thing that usually comes to mind is NAND flash like that used in SSD’s or in microcontrollers to hold on-board code. Of course, there is also EEPROM and other types of NVM as well that can be used to hold data and code for the multitude of connected devices that are so common now. For… Read More