Back in September 2019 semiengineering.com published an article called “The Hidden Potential of Test Engineers”. This article was of particular interest to me having previously worked as a mixed signal test development engineer.
Within the article Carl Moore explained that test engineers have the potential to increase revenue.… Read More
I had a chance to preview the subject webinar recently. Yes, it’s a long title, but a very important topic. When it comes to hyper-scale data centers, there are substantial challenges associate with thermal management, power distribution and processing performance. Moortec explores approaches to these issues using their … Read More
At the recent TSMC OIP Ecosystem Forum and Technology virtual events, TSMC re-affirmed their previous prediction that 5G is going to be a multi-year silicon mega-trend with the biggest drivers being the ramp up of 5G handsets, supporting infrastructure and the continued growth of high performance computing (HPC).
We all want… Read More
No-one likes being put on the spot and yet we all like a forecast…and as we all know, the only guarantee with a forecast is that it is wrong. Sports commentators have carved out a special niche for themselves with the ‘commentators curse’, just as they extol the virtues of an individual or a team, the sporting gods prove them wrong in … Read More
Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More
We take for granted today the staggering precision of modern technology. Cars, electronics, robots and medical equipment, all come off the factory floor composed of effortlessly interchangeable parts; but this was not always the case. In the late 18th century most things that required any kind of precision were made by hand, … Read More
Managing and controlling thermal conditions in-chip is nothing new and embedded temperature monitoring has been going on for many years. What is changing however, is the granularity and accuracy of the sensing now available to SoC design teams. Thermal activity can be quite destructive and if not sufficiently monitored can … Read More
In this, the second part of a two-part series we delve further into defining worst case, this time focusing specifically on device performance.
In the last blog we talked about the steady increase in power density per unit silicon area and how worst case is definitely getting worse. We discussed how in each new FinFET node the dynamic… Read More
In this first part of a 2-part blog series, we look at defining worst case conditions, focusing specifically on device power.
With great power, comes great responsibility…
With each new technology node especially FinFET, the dynamic conditions within a chip are changing and becoming more complex in terms of process speeds, thermal… Read More
Rene Donkers, the company’s Co-founder and CEO, started his EDA career at Sagantec where he became responsible for world wide customer support and operations management. Ten years ago, Rene and a handful of people noticed a need in the design community for a standardized (portable) IP Validation approach to replace internal… Read More