The exponential growth of cloud data centers is well-known. Driven by the demands of massive applications like generative AI, state-of-the-art data centers present substantial challenges in terms of power consumption. And AI is poised to drive a 160% increase in data center power demand while also increasing demands on storage… Read More
What is Different About Synopsys’ Comprehensive, Scalable Solution for Fast Heterogeneous Integration
Multi-die design has become the center of a lot of conversation lately. The ability to integrate multiple heterogeneous devices into a single package has changed the semiconductor landscape, permanently. This technology has opened a path for continued Moore’s Law scaling at the system level. What comes next will truly be exciting.… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More
A Deep Dive into SoC Performance Analysis: Optimizing SoC Design Performance Via Hardware-Assisted Verification Platforms
Part 2 of 2 – Performance Validation Across Hardware Blocks and Firmware in SoC Designs
Part 2 explores the performance validation process across hardware blocks and firmware in System-on-Chip (SoC) designs, emphasizing the critical role of Hardware-Assisted Verification (HAV) platforms. It outlines the validation workflow… Read More
Synopsys Brings Embedded Memory to the Future with its Flexible, IP-Based Compilers
There is a revolution happening that is fueled by innovation in areas such as AI, IoT and autonomous driving. These new systems put incredible stress on next-generation semiconductor technology. Faster processing, higher density and lower latency must all be delivered with reduced power and thermal profiles. One technology… Read More
A Deep Dive into SoC Performance Analysis: What, Why, and How
Part 1 of 2 – Essential Performance Metrics to Validate SoC Performance Analysis
Part 1 provides an overview of the key performance metrics across three foundational blocks of System-on-Chip (SoC) designs that are vital for success in the rapidly evolving semiconductor industry and presents a holistic approach to optimize… Read More
Ultra Ethernet and UALink IP solutions scale AI clusters
AI infrastructure requirements are booming. Larger AI models carry hefty training loads and inference latency requirements, driving an urgent need to scale AI acceleration clusters in data centers. Advanced GPUs and NPUs offer solutions for the computational load. However, insufficient bandwidth or latency between servers… Read More
Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools
There is ample evidence that technologies such as high-performance computing, next-generation servers, and AI accelerators are fueling unprecedented demands in data processing speed with massive data storage, lower latency, and lower power. Heterogeneous system integration, more commonly called 2.5 and 3D IC design, … Read More
Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)
As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More
SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments
When contemplating the Lego-like hardware and software structure of a leading system-on-chip (SoC) design, a mathematically inclined mind might marvel at the tantalizing array of combinatorial possibilities among its hardware and software components. In contrast, the engineering team tasked with its validation may have… Read More