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I was asked to present at Nikon’s LithoVision event again this year. LithoVision is held the day before the SPIE Advanced Lithography Conference also in San Jose. The following is a write up of my talk.… Read More
Strong Overall Market Growth but a Slowdown Looms
After six years of single digit percentage growth in the overall semiconductor market, 2017 saw almost 22% growth and 2018 year-to-date is up roughly 17% (based on numbers published by the world semiconductor trade statistics). The big growth driver the last two years has been … Read More
At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More
At IEDM last week Anthony (Tony) Yen, Vice President and Head, Technology Development Centers Worldwide for ASML presented a paper entitled “EUV Lithography at Threshold of High-Volume Manufacturing” authored by Anthony Yen, Hans Meiling, and Jos Benschop. At IEDM I had a chance to sit down with Tony and discuss the paper and … Read More
At SEMICON West I attended the imec technology forum, multiple Tech Spot presentations and conducted a number of interviews relevant to advanced lithography and EUV. In this article I will summarize what I learned plus make some comments on the outlook for EUV.… Read More
The IEEE Interconnect Technology Conference (IITC): Advanced Metallization Conference was held June 4th through 7th in Santa Clara. Imec presented multiple papers on comparing copper, cobalt and ruthenium interconnect. One paper in particular caught my eye: Marleen H. van der Veen, # N. Heylen, O. Varela Pedreira, S. Decoster,… Read More
At the Imec technology forum in Belgium, Dan Mocuta and Juliana Radu presented “Evolution and Disruption: A Perspective on Logic Scaling and Beyond”, I also had a chance to sit down with Dan and discuss the presentation.
Device scaling
Scaling of devices will only get you so far, you need to look at new devices and new… Read More
I got a tip sheet today for the upcoming 2018 Symposia on VLSI Technology & Circuits to be held June 19th through 21st in Honolulu, Hawaii. There is some interesting information on Samsung’s 10nm, 8nm and 7nm processes in the tip sheet:… Read More
On their first quarter earnings call Intel announced that volume production of 10nm has been moved from the second half of 2018 to 2019 due to yield issues. Specifically, they are shipping 10nm in low volume now, but yield improvement has been slower than anticipated. They report that they understand the yield issues but that improvements… Read More
The most viewed blogs I write for SemiWiki are consistently blogs comparing the four leading edge logic producers, GLOBALFOUNDRIES (GF), Intel, Samsung (SS) and TSMC. Since the last time I compared the leading edge new data has become available and several new processes have been introduced. In this blog I will update the current… Read More
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