Banner Electrical Verification The invisible bottleneck in IC design updated 1
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Being Intelligent about AI ASICs

Being Intelligent about AI ASICs
by Tom Simon on 06-06-2018 at 12:00 pm

The progression from CPU to GPU, FPGA and then ASIC affords an increase in throughput and performance, but comes at the price of decreasing flexibility and generality. Like most new areas of endeavor in computing, artificial intelligence (AI) began with implementations based on CPU’s and software. And, as have so many other applications,… Read More


Webinar: Custom SoCs for Narrowband IoT

Webinar: Custom SoCs for Narrowband IoT
by Daniel Nenni on 05-30-2018 at 7:00 am

This joint CEVA and Open-Silicon webinar, moderated by myself, will elaborate on Narrowband IoT (NB-IoT) custom SoC solutions that are based on the CEVA-Dragonfly IP subsystem, and serve a wide range of cost- and power-sensitive IoT applications. Those joining the webinar will learn about the CEVA-Dragonfly NB1 IP subsystem,… Read More


China Chips Taiwan and Technology

China Chips Taiwan and Technology
by Robert Maire on 05-28-2018 at 12:00 pm

Three critical China issues; Trade, Taiwan & Technology. China is a “double edge sword” of risk & opportunity. These issues greatly impact stock valuations. We have recently given a presentation at both the SEMI ASMC conference in Saratoga Springs and The Confab conference in Las Vegas. Both conferences… Read More


China Semiconductor Equipment China Sales at Risk

China Semiconductor Equipment China Sales at Risk
by Robert Maire on 05-27-2018 at 7:00 am

We have been on a roller coaster ride of on again off again trade talk between China and the US. It is unclear where we are on a day by day basis but of late it appears that we are not seeing a lot of progress and some progress we thought we had made may not have actually happened.… Read More


Webinar: RISC-V IoT Security IP

Webinar: RISC-V IoT Security IP
by Daniel Nenni on 05-23-2018 at 7:00 am

Disruptive technology and disruptive business models are the lifeblood of the semiconductor industry. My first disruptive experience was with Artisan Components in 1998. The semiconductor industry started cutting IP groups which resulted in a bubble of start-up IP companies including Artisan, Virage Logic, Aspec Technologies,… Read More


Chip Equipment where to from here?

Chip Equipment where to from here?
by Robert Maire on 05-20-2018 at 12:00 pm

We may know the top, do we know the bottom? What is the downside in NAND, DRAM, Foundry. Can China help or is risk worse than upside?

It would appear that our concerns in our preview piece prior to the AMAT call came true as the stock now has a “4” handle, NAND is in question and display is down.

However its not like business … Read More


AMAT has OK Q2 but Q3 flat to down

AMAT has OK Q2 but Q3 flat to down
by Robert Maire on 05-20-2018 at 7:00 am

“Puts & Takes” “Reduced NAND Expectations” 2019 to be down from 2018. Applied Materials reported a good quarter coming in at $1.22 EPS and $4.567B in revenues versus street of $1.14 and $4.45B.

However if we back out the buy back of 4% it would have been around $1.17 so a slight beat. Guidance was for … Read More


ZTE Caving shows China Trade Tirade is Hollow

ZTE Caving shows China Trade Tirade is Hollow
by Robert Maire on 05-18-2018 at 7:00 am

We have been watching the ZTE saga play out on the public stage as we think it is an extremely important leading example of how the administration will truly act. As we all know, actions speak louder than words, and in the case of ZTE our words said one thing and our actions said something else. We need to analyze what the actions really… Read More


TSMC Technologies for Mobile and HPC

TSMC Technologies for Mobile and HPC
by Alex Tan on 05-10-2018 at 12:00 pm

During TSMC 2018 Technology Symposium, Dr. B.J. Woo, TSMC VP of Business Development presented market trends in the area of mobile applications and HPC computing as well as shared TSMC progress in making breakthrough efforts in the technology offerings to serve these two market segments.

Both 5G and AI are taking the center stage… Read More


Formal Signoff – a Cisco Perspective

Formal Signoff – a Cisco Perspective
by Bernard Murphy on 05-08-2018 at 7:00 am

The second segment of Oski’s most recent “Decoding Formal” event was a talk by Anatoli Sokhatski (formal tech lead at Cisco) on training and methodology development for a structured and scalable approach to formal verification, particularly with emphasis on formal signoff.

Anatoli stressed that he and others in the team did … Read More