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Meltdown, Spectre and Formal

Meltdown, Spectre and Formal
by Bernard Murphy on 04-19-2018 at 7:00 am

Once again Oski delivered in their most recent Decoding Formal session, kicking off with a talk on the infamous Meltdown and Spectre bugs and possible relevance of formal methods in finding these and related problems. So far I haven’t invested much effort in understanding these beyond a hand-waving “cache and speculative execution”… Read More


FlexE at SoC IP Days with Open Silicon

FlexE at SoC IP Days with Open Silicon
by Daniel Nenni on 03-30-2018 at 12:00 pm

On Thursday April 5th the Design and Reuse SoC IP days continues in Santa Clara at the Hyatt Regency (my favorite hangout). SemiWiki is a co-sponsor and I am Chairman of the IP Security Track. More than 400 people have registered thus far and I expect a big turnout, if you look at the program you will see why. You should also know that registration… Read More


FPGA, Data and CASPA: Spring into AI (2 of 2)

FPGA, Data and CASPA: Spring into AI (2 of 2)
by Alex Tan on 03-23-2018 at 12:00 pm

Adding color to the talks, Dr. Jeff Welser, VP and IBM Almaden Research Lab Director showed how AI and recent computing resources could be harnessed to contain data explosion. Unstructured data growth by 2020 would be in the order of 50 Zetta-bytes (with 21 zeros). One example, the Summit supercomputer developed by IBM for use at… Read More


Leading Edge Logic Landscape 2018

Leading Edge Logic Landscape 2018
by Scotten Jones on 03-16-2018 at 2:00 pm

The most viewed blogs I write for SemiWiki are consistently blogs comparing the four leading edge logic producers, GLOBALFOUNDRIES (GF), Intel, Samsung (SS) and TSMC. Since the last time I compared the leading edge new data has become available and several new processes have been introduced. In this blog I will update the current… Read More


An Advanced-User View of Applied Formal

An Advanced-User View of Applied Formal
by Bernard Murphy on 03-08-2018 at 7:00 am

Thanks to my growing involvement in formal (at least in writing about it), I was happy to accept an invite to this year’s Oski DVCon dinner / Formal Leadership Summit. In addition to Oski folks and Brian Bailey (an esteemed colleague at another blog site, to steal a Frank Schirrmeister line), a lively group of formal users attended… Read More


SPIE Advanced Lithography 2018 – EUV Status

SPIE Advanced Lithography 2018 – EUV Status
by Scotten Jones on 03-05-2018 at 7:00 am

This year the Advanced Lithography Conference felt very different to me than the last couple of years. I think it was Chris Mack who proclaimed it the year of Stochastics. EUV has dominated the conference for the last several years but in the past the conversation has been mostly centered on the systems, system power and uptime.

I … Read More


Semiconductors could be up 12% in 2018

Semiconductors could be up 12% in 2018
by Bill Jewell on 03-02-2018 at 12:00 pm

The global semiconductor market grew 21.6% for the year 2017, according to World Semiconductor Trade Statistics (WSTS). The market was much stronger than anticipated at the beginning of year. Semiconductor Intelligence tracked publicly available forecasts to determine which was the most accurate. We used forecasts made … Read More


LithoVision 2018 The Evolving Semiconductor Technology Landscape and What it Means for Lithography

LithoVision 2018 The Evolving Semiconductor Technology Landscape and What it Means for Lithography
by Scotten Jones on 02-25-2018 at 5:00 pm

I was invited to present at Nikon’s LithoVision event held the day before the SPIE Advanced Lithography Conference in San Jose. The following is a write up of the talk I gave. In this talk I discuss the three main segments in the semiconductor industry, NAND, DRAM and Logic and how technology transitions will affect lithography.… Read More


Herb Reiter on the Challenges of 2.5D ASIC SiPs

Herb Reiter on the Challenges of 2.5D ASIC SiPs
by Daniel Nenni on 02-23-2018 at 12:00 pm

Years ago my good friend Herb Reiter promoted the importance of 2.5D packaging to anybody and everybody who would listen including myself. Today Herb’s vision is in production and the topic of many papers, webinars, and conferences. According to Herb, and I agree completely, advanced IC packaging is an important technology for… Read More


What does a Deep Learning Chip Look Like

What does a Deep Learning Chip Look Like
by Daniel Nenni on 02-16-2018 at 12:00 pm

There’s been a lot of discussion of late about deep learning technology and its impact on many markets and products. A lot of the technology under discussion is basically hardware implementations of neural networks, a concept that’s been around for a while.

What’s new is the compute power that advanced semiconductor technology… Read More