At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More
Ethernet Enhancements Enable Efficiencies
Up until 2016, provisioning Ethernet networks was a little bit like buying hot dogs and hot dog buns, in that you could not always match up the quantities to get the most efficient configuration. That dramatically changed when the specification for Ethernet FlexE was adopted by the Optical Internetworking Forum as OIF-FLEXE-01.0.… Read More
Slowing growth in 2019 for GDP and semiconductors
Growth in the global economy is expected to slow in 2019 from 2018. Ten economic forecasts released in the last two months show the percentage point change in World GDP from 2018 to 2019 ranging from minus 0.1 points to minus 0.4 points.
[table] border=”1″ cellspacing=”0″ cellpadding=”0″… Read More
CAPEX Cuts and Microns Memory Markdown
For those who have been paying any attention to the semiconductor industry its no surprise that memory demand and therefore pricing is down from its peak earlier in the year. Its not getting better any time fast.
After several strong years of demand and pricing, which was followed by enormous CAPEX spending we are seeing the standard… Read More
56G and 112G SerDes Where the rubber meets the road
No matter how high the processing capability of a chip, its overall performance is limited by IO speed. This is very similar to a car with low performance tires, a powerful engine will not be able to transfer its energy to the ground effectively. There is quite literally a race going on between core processing and IO speeds for transferring… Read More
IEDM 2018 – ASML EUV Update
At IEDM last week Anthony (Tony) Yen, Vice President and Head, Technology Development Centers Worldwide for ASML presented a paper entitled “EUV Lithography at Threshold of High-Volume Manufacturing” authored by Anthony Yen, Hans Meiling, and Jos Benschop. At IEDM I had a chance to sit down with Tony and discuss the paper and … Read More
Changes Coming at the Top in Semiconductor Equipment Ranking
Semiconductor equipment vendor ranking, which didn’t change much between 2016 and 2017, is undergoing a makeover, as Lam Research, ASML, and Tokyo Electron (TEL) are switching places and top-ranked Applied Materials is getting closer to losing its number one ranking.
Since the 1990s, Applied Materials has been the market leader… Read More
Could China Conflict Curtail Chip Comeback? Part 2
In our recent note sent several days ago we suggested that the China conflict would come back to haunt the US chip industry. From a stock perspective we suggested taking short term gains from a recent bounce back off the table. Both ideas turned out true, but way faster than we had thought! Not only have investors figured out that the… Read More
Could China Conflict Curtail Chip Comeback?
At the recent trade talks in South America, the US and China both kicked the can down the road as neither one were obviously willing to do a deal nor had done any background work to get a deal done. Instead we have a bunch of empty promises and vague and conflicting descriptions of what was not really even agreed to.
Essentially worthless… Read More
RISC-V End to End Solutions for HPC and Networking
Semiconductor IP is one of the more exciting and most viewed topics we cover on SemiWiki, it has been that way since we began in 2011 and that trend will continue indefinitely, my opinion.
Semiconductor IP: Total Blogs: 640: Total Views: 3253751: Average: 5084
Based on the design starts we track, Cloud Computing is a leading semiconductor… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet