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At the recent TSMC OIP symposium, Bill Acito from Cadence and Chin-her Chien from TSMC provided an insightful presentation on their recent collaboration, to support TSMC’s Integrated FanOut (InFO) packaging solution. The chip and package implementation environments remain quite separate. The issues uncovered in bridging… Read More
It is often said that things go in big cycles. One example of this is the design and manufacturing products. People long ago used to build their own things. Think of villagers or settlers hundreds of years ago, if they needed something they would craft it themselves. Then came the industrial revolution and two things happened. One… Read More
Paul M. did an excellent job summarizing the technical information that TSMC presented at the recent Open Innovation Platform symposium. I’d like to also share an impression on four areas that struck me as key to TSMC’s strategy.… Read More
Today it is TSMC’s OIP Ecosystem Innovation forum. This is an annual event but is also a semi-annual update on TSMC’s processes, investment, volume ramps and more. TSMC have changed the rules for the conference this year: they have published all the presentations by their partners/customers. Tom Quan of TSMC told… Read More
Rarely do I fly first class but I did on my recent trip to Asia. It was one of the new planes with pod-like seats that transforms into a bed. The flight left SFO at 1 A.M. so I fell asleep almost immediately missing the first gourmet meal. About half way through the flight I found myself barely awake staring straight up and what do I see? STARS!… Read More
We all have echoed the fact that the arrival of fabless business model in the semiconductor industry has transformed it completely. The book, “Fabless: The Transformation of the Semiconductor Industry” provides several stories around that. In the backdrop of that, one key point to ponder upon is the start of pure-play foundries;… Read More
This is the 5[SUP]th[/SUP] TSMC Open Innovation Platform Ecosystem Forum and it is not to be missed. Please note that the location has moved from the San Jose Convention Center to the Santa Clara Convention Center which is literally right across the street from the new Levi’s Stadium. If you haven’t been to the new stadium you really… Read More
The TSMC quarterly conference call was last week and of course it stirred up quite a bit of controversy. Let me share with you my experience, observations, and opinions and maybe together we can come up with an accurate prediction for 2016. First let’s take a look at 20nm and what people now call the “Apple effect.”
Correct… Read More
IBM recently disclosed a working 7nm test chip generating a lot of excitement in the semiconductor industry and also in the mainstream media. In this article I wanted to explore the 14nm, 10nm and 7nm nodes, the status of the key competitors at each node and what it may mean for the companies.
Five years ago TSMC started 28nm mass production and it went on to become one of the most versatile and successful process technologies in history. The first wave was triggered by an unprecedented demand for application processors from smartphone and tablet vendors. Today it’s widely assumed that 28nm demand will continue growing… Read More
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[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)