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Layout Pattern Matching for DRC, DFM, and Yield Improvement

Layout Pattern Matching for DRC, DFM, and Yield Improvement
by Tom Dillinger on 06-01-2016 at 12:00 pm

It is truly amazing to consider the advances in microelectronic process development, using 193i photolithography. The figure below is a stark reminder of the difference between the illuminating wavelength and the final imaged geometries. This technology evolution has been enabled by continued investment in mask data generation… Read More


TSMC Update at #53DAC!

TSMC Update at #53DAC!
by Daniel Nenni on 05-31-2016 at 4:00 pm

TSMC is having an interesting year for sure. I was at the TSMC Symposium in Hsinchu last week and everyone was talking about the new 16FFC process. Silicon is out and it is exceeding expectations leading some people (me included) to believe that TSMC 16FFC will be the next TSMC 28nm in regards to popularity. To be clear, 16FFC is currently… Read More


How TSMC Tackles Variation at Advanced Nodes

How TSMC Tackles Variation at Advanced Nodes
by Pawan Fangaria on 05-27-2016 at 12:00 pm

The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More


ARM tests out TSMC 10FinFET – with two cores

ARM tests out TSMC 10FinFET – with two cores
by Don Dingee on 05-25-2016 at 4:00 pm

About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More


IMEC Technology Forum (ITF) – IC Innovation

IMEC Technology Forum (ITF) – IC Innovation
by Scotten Jones on 05-25-2016 at 7:00 am

IMEC is a technology research center located in Belgium that is one of the premier semiconductor research centers in the world today. The IMEC Technology Forum (ITF) is a two-day event attended by approximately 1,000 people to showcase the work done by IMEC and their partners.

Luc Van Den Hove is the president and CEO of IMEC and he… Read More


TSMC Leads Again with 3-D Packaging!

TSMC Leads Again with 3-D Packaging!
by Daniel Nenni on 05-24-2016 at 4:00 pm

Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.

CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More


What Does an MPW and a Pizza Have in Common?

What Does an MPW and a Pizza Have in Common?
by Daniel Nenni on 05-23-2016 at 12:00 pm

Design starts are critical to the growth of the semiconductor industry so enabling them is a common theme on SemiWiki. One thing we have not covered in detail is multi-project wafer services (MPW) which is the equivalent of ride sharing through the initial mask and wafer process. Larger semiconductor companies already do this … Read More


According with ST, SiC Power Devices will Accelerate Automotive Electrification

According with ST, SiC Power Devices will Accelerate Automotive Electrification
by Eric Esteve on 05-16-2016 at 10:39 am

Silicon Carbide (SiC) is a very interesting material. If you find in nature the mineral moissanite, it will be only minute quantities in certain types of meteorite. The moissanite physical properties are very similar to these of diamond, in term of density and abrasive power. In the semiconductor industry, SiC is characterized… Read More


Samsung Could Have A Winner With The Gear 360 VR Camera

Samsung Could Have A Winner With The Gear 360 VR Camera
by Patrick Moorhead on 05-09-2016 at 12:00 pm

For success, VR playback and content must be robust
The world of VR is split into two different areas, tethered PC VR and mobile VR. The reason why so many companies are going after mobile VR is because that’s where all of the volume is expected to be in VR. As a result, you have companies like Samsung Electronics and LG Electronics introducing… Read More


Why is NXP Moving to FD-SOI?

Why is NXP Moving to FD-SOI?
by Ron Martino on 05-08-2016 at 11:00 am

The latest generations of power efficient and full-featured applications processors in NXP’s very successful and broadly deployed i.MX platform are being manufactured on 28nm FD-SOI. The new i.MX 7 series leverages the 32-bit ARM v7-A core, targeting the general embedded, e-reader, medical, wearable and IoT markets, where… Read More