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IEDM 2017 Preview

IEDM 2017 Preview
by Scotten Jones on 10-20-2017 at 7:00 am

The 63rd annual IEDM (International Electron Devices Meeting) will be held December 2nd through 6th in San Francisco. In my opinion IEDM is one of, if not the premier conference on leading edge semiconductor technology. I will be attending the conference again this year and providing coverage for SemiWiki. As a member of the press… Read More


Reliability Signoff for FinFET Designs

Reliability Signoff for FinFET Designs
by Bernard Murphy on 10-17-2017 at 7:00 am

Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More


TSMC Teamwork Translates to Technical Triumph

TSMC Teamwork Translates to Technical Triumph
by Tom Simon on 10-02-2017 at 12:00 pm

Most people think that designing successful high speed analog circuits requires a mixture of magic, skill and lots of hard work. While this might be true, in reality it also requires a large dose of collaboration among each of the members of the design, tool and fabrication panoply. This point was recently made abundantly clear … Read More


This is a Different GLOBALFOUNDRIES!

This is a Different GLOBALFOUNDRIES!
by Daniel Nenni on 09-22-2017 at 7:00 am

Having followed GF since its inception, I agree with CTO Gary Patton, what we are seeing today truly is a different GLOBALFOUNDRIES! Our first GF blog was published on 9/13/2009 and we have done a total of 173 GF related blogs that have collected more than 1.5M views thus far. 72 of those blogs were written by me so I have followed this… Read More


TSMC OIP and the Insatiable Computing Trend!

TSMC OIP and the Insatiable Computing Trend!
by Daniel Nenni on 09-14-2017 at 12:00 am

This year’s OIP was much more lighthearted than I remember which is understandable. TSMC is executing flawlessly, delivering new process technology every year. Last year’s opening speaker, David Keller, used the phrase “Celebrate the way we collaborate” which served as the theme for the conference. This year David’s… Read More


Solido Debuts New ML Tool at TSMC OIP!

Solido Debuts New ML Tool at TSMC OIP!
by Daniel Nenni on 09-08-2017 at 7:00 am

The TSMC OIP Ecosystem Forum is upon us and what better place to debut a new tool to prevent silicon failures. Solido Design Automation just launched its latest tool – PVTMC Verifier – and will be demonstrating it in their booth at OIP. This is the third product that was developed within its Machine Learning Labs and is… Read More


Breakfast with Aart de Geus and the Foundries!

Breakfast with Aart de Geus and the Foundries!
by Daniel Nenni on 09-06-2017 at 7:00 am

Being the number one EDA and the number one IP company does have its advantages and the resulting foundry relationships are a clear example. One of the DAC traditions that I truly enjoy is the Synopsys foundry breakfasts. Not only does Synopsys welcome scribes, they reserve a table up front for us and Synopsys CEO Aart de Geus has been… Read More


Apple iPhone Super Cycle Update!

Apple iPhone Super Cycle Update!
by Daniel Nenni on 09-01-2017 at 7:00 am

In 2014 Apple released the iPhone 6 which included the first SoC built on a TSMC (20nm) process. This phone started what many call a “Super Cycle” of people upgrading. According to Apple, they now have more than 1 billion activated devices so this super cycle could be seriously super, absolutely.… Read More


High Bandwidth Memory ASIC SiPs for Advanced Products!

High Bandwidth Memory ASIC SiPs for Advanced Products!
by Daniel Nenni on 08-30-2017 at 7:00 am

When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More