The 63rd annual IEDM (International Electron Devices Meeting) will be held December 2nd through 6th in San Francisco. In my opinion IEDM is one of, if not the premier conference on leading edge semiconductor technology. I will be attending the conference again this year and providing coverage for SemiWiki. As a member of the press… Read More
Reliability Signoff for FinFET Designs
Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More
TSMC Teamwork Translates to Technical Triumph
Most people think that designing successful high speed analog circuits requires a mixture of magic, skill and lots of hard work. While this might be true, in reality it also requires a large dose of collaboration among each of the members of the design, tool and fabrication panoply. This point was recently made abundantly clear … Read More
GLOBALFOUNDRIES is Hitting on all Cylinders
On September 20th GLOBALFOUNDRIES (GF) held their annual technology conference. The conference presented an opportunity to hear the latest on the fascinating journey GF has been on.… Read More
This is a Different GLOBALFOUNDRIES!
Having followed GF since its inception, I agree with CTO Gary Patton, what we are seeing today truly is a different GLOBALFOUNDRIES! Our first GF blog was published on 9/13/2009 and we have done a total of 173 GF related blogs that have collected more than 1.5M views thus far. 72 of those blogs were written by me so I have followed this… Read More
TSMC OIP and the Insatiable Computing Trend!
This year’s OIP was much more lighthearted than I remember which is understandable. TSMC is executing flawlessly, delivering new process technology every year. Last year’s opening speaker, David Keller, used the phrase “Celebrate the way we collaborate” which served as the theme for the conference. This year David’s… Read More
Solido Debuts New ML Tool at TSMC OIP!
The TSMC OIP Ecosystem Forum is upon us and what better place to debut a new tool to prevent silicon failures. Solido Design Automation just launched its latest tool – PVTMC Verifier – and will be demonstrating it in their booth at OIP. This is the third product that was developed within its Machine Learning Labs and is… Read More
Breakfast with Aart de Geus and the Foundries!
Being the number one EDA and the number one IP company does have its advantages and the resulting foundry relationships are a clear example. One of the DAC traditions that I truly enjoy is the Synopsys foundry breakfasts. Not only does Synopsys welcome scribes, they reserve a table up front for us and Synopsys CEO Aart de Geus has been… Read More
Apple iPhone Super Cycle Update!
In 2014 Apple released the iPhone 6 which included the first SoC built on a TSMC (20nm) process. This phone started what many call a “Super Cycle” of people upgrading. According to Apple, they now have more than 1 billion activated devices so this super cycle could be seriously super, absolutely.… Read More
High Bandwidth Memory ASIC SiPs for Advanced Products!
When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More
MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency