In June of 2013 Edward Snowden copied and leaked classified information from the National Security Agency (NSA). His actions exposed numerous surveillance programs that many governments around the world reacted to, including China. In September of 2013 China Vice Premier Ma Kai declared semiconductors a key sector for the … Read More
IEDM 2016 – 7nm Shootout
In the first session of IEDM on Monday, December 5th there were two papers presented on 7nm processes. The first paper was from TSMC and the second paper was from the Global Alliance of GLOBALFOUNDRIES, IBM and Samsung.… Read More
IEDM 2016 – GLOBALFOUNDRIES 22FDX Update
At IEDM in 2015 I had a chance to sit down with Subramani (Subi) Kengeri and get a briefing on GLOBALFOUNDRIES 22FDX technology. At IEDM 2016 Rick Carter of GLOBALFOUNDRIES presented a paper on 22FDX. Following Rick’s presentation, I had a chance to sit down with Rick and John Pellerin, VP of Technology and Integration and … Read More
GLOBALFOUNDRIES ASIC Update!
Back in my IP days we spent a lot of time with the ASIC companies chasing multi-million dollar licensing deals. IBM was a fierce ASIC competitor back then with leading edge processes and a silicon proven IP catalog that was unmatched.
Unfortunately that ended at 65nm as the pure-play foundries (TSMC and UMC) and fabless ASIC companies… Read More
An End of Year View of Semi Consolidation
The last couple of years have been tumultuous for the semiconductor market. IC Insights just released a report showing just how much consolidation has concentrated market strength in a small number of companies. The report (which excludes fabs) shows that the 5 top companies – Intel, Samsung, Qualcomm, Broadcom and SK Hynix – … Read More
Advanced Semiconductor Process Cost Trends
The cost trend for leading edge semiconductor technologies is a subject of some controversy in the industry. Cost is a complex issue with many interacting factors and much of the information out in the industry is in my opinion misleading or incorrect. In this article, I will discuss each of the factors as well as present a view of … Read More
Design for Fanout Packaging
In constant pursuit of improved performance, power and cost, chip and system designers always want to integrate more functions together because this minimizes inter-device loads (affecting performance and power) and bill of materials on the board (affecting cost). However it generally isn’t possible to integrate … Read More
Thin film Semiconductor Solutions for an Energy-Efficient Future
For an industry with an estimated revenue potential of $22 billion by 2022, and a CAGR of 14% throughout 2016–2022, the slightest innovation in current modules holds considerable profit potential. The thin film semiconductor market has evolved from the previous generation of semiconductor electronics in the best interests… Read More
5 of the Top 20 Semiconductor Suppliers to Show Double-Digit Gains in 2016!
Semiconductor Market Researcher IC Insights released an update to the 2016 semiconductor sales forecast which is interesting on many different levels. It really has been an exciting year for the semiconductor industry, absolutely. Two of the stars of this year’s report happen to be two of my favorite fabless companies, Nvidia… Read More
EUV transition comes into focus
We attended ASML’s analyst day in New York on Halloween. We were very impressed with the quality, content and clarity of the presentations and thought it was one of the best strategic positioning presentations we have seen in the semi industry. We also had an opportunity to meet with several members of senior management after… Read More
Bluetooth 6.0 Channel Sounding is Here