I have written multiple articles about this year’s SPIE Advanced Lithography Conference describing all of the progress EUV has made in the last year. Source power is improving, photoresists are getting faster, prototype pellicles are in testing, multiple sites around the world are exposing wafers by the thousands and more. … Read More
My morning with Andy Grove
I worked briefly at Intel in 1991-2. At the time, the corporate culture was based on the theory of ‘constructive confrontation.’ For most, that meant that in the clash of good ideas, the best one would prevail. For some at Intel, however, constructive confrontation was a blood sport. (I trust things have improved in the past quarter… Read More
The time Andy Grove came to Fortune and refused to meet with the editors
In my nearly thirty year career at FORTUNE magazine, I got to know a host of larger than life characters. But few loom larger in memory than the diminutive dynamo who sadly passed away last night, Andy Grove.
Amid the stream of obits and reminiscences rightly hailing Andy’s extraordinary career as CEO of Intel, his major contributions… Read More
Who will provide data center Soc of the future, Intel or Qualcomm ?
Intel has been incredibly successful by designing high performance server SoC to address the data center market segment, and the chance to see the company loosing large market share is pretty low, at least in the short term. Now, if we look at the really long term, 2030 or even 2040, like did the Semiconductor Industry Association… Read More
Andy Grove’s Less Remembered Intel
The following paragraphs present another one of those articles that I wrote for a Cyber Media publication, probably in the year 2000. It’s been almost fifteen years since then. When I read Sunit Rikhi’s glowing tribute to Andy Grove, a few grey cells stirred in my brain and I recalled that I had written something about the Intel that… Read More
10nm SRAM Projections – Who will lead
At ISSCC this year Samsung published a paper entitled “A 10nm FinFET 128Mb SRAM with Assist Adjustment System for Power, Performance, and Area Optimization. In the paper Samsung disclosed a high density 6T SRAM cell size of 0.040µm[SUP]2[/SUP]. I thought it would be interesting to take a look at how this cell size stacks … Read More
Good bye and thank you, Andy Grove!
You are gone. And with you, gone is one of the greatest leaders of our times.
In the coming days many voices will speak about the ways in which you touched countless lives, inspired a generation of engineers to create and fuel the digital revolution, and demonstrated your own brand of leadership traits in pursuit of excellence. My … Read More
Intel Adds ‘Authenticate’ Multi-Factor Security Feature
Last summer, Intel launched their 14nm, 6th Generation Core processors, code-named ‘Skylake’, alongside Microsoft’s new Windows 10 operating system. As things usually go in the enterprise world, the commercial 6th Generation of Intel’s Core vPro processors weren’t too far behind with increased security and manageability… Read More
Intel EUV Photoresist Progress and ASML High NA EUV
SPIE Days 3 and 4:
Anna Lio of Intel presented EUV resists: What’s next?
Intel wants to insert EUV at 7nm but it has to be ready and economical. Critical Dimension Uniformity (CDU), Line Width Roughness (LWR) and edge placement/stochastics are all stable on 22nm, 14nm and 10nm pilot lines.… Read More
TSMC and Intel on the Long Road to EUV
Today is the first day of the SPIE Advanced Lithography Conference and Extreme Ultraviolet (EUV) updates were a big focus.… Read More