Although version 2.0 of the Computer Express Link (CXL) standard is just making it into new designs, the next generation, version 3.0, has been approved and is now ready for designers to implement the new silicon and firmware needed to meet the new standard’s performance specifications. CXL, an open industry-standard interconnect,… Read More
Semiconductor Intellectual Property
WEBINAR: O-RAN Fronthaul Transport Security using MACsec
5G provides a range of improvements compared to existing 4G LTE mobile networks in regards to capacity, speed, latency and security. One of the main improvements is in the 5G RAN; it is based on a virtualized architecture where functions can be centralized close to the 5G core for economy or distributed as close to the edge as possible… Read More
Podcast EP107: The Impact of Arteris IP and Its Partnerships on the Automotive Industry and Beyond
Dan is joined by Michal Siwinski, Chief Marketing Officer for Arteris IP. Arteris provides network-on-chip interconnect semiconductor IP and deployment technology to accelerate SoC development and integration for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers.… Read More
Ultra-efficient heterogeneous SoCs for Level 5 self-driving
The latest advanced driver-assistance systems (ADAS) like Mercedes’ Drive Pilot and Tesla’s FSD perform SAE Level 3 self-driving, with the driver ready to take back control if the vehicle calls for it. Reaching Level 5 – full, unconditional autonomy – means facing a new class of challenges unsolvable with existing technology… Read More
Truechip: Customer Shipment of CXL3 VIP and CXL Switch Model
The tremendous amount of data generated by AI/ML driven applications and other hyperscale computing applications have forced the age old server architecture to change. The new architecture is driven by the resource disaggregation paradigm, wherein memory and storage are decoupled from the host CPU and managed independently… Read More
WEBINAR: Unlock your Chips’ Full Data Transfer Potential with Interlaken
Way back in the early 2000s when XAUI was falling short on link flexibility a search for an alternative chip-to-chip data transfer interface with SPI like features lead Cisco Systems and Cortina System to put forward the proposal for the Interlaken standard. The new standard married the best of XAUI’s serialized data and SPI’s … Read More
CEO Interview: Jan Peter Berns from Hyperstone
Since 2012, Dr. Jan Peter Berns is the CEO of Hyperstone, a producer of Flash Memory Controllers for Industrially Embedded Storage Solutions. Before that, he held a Senior Manager Position at Toshiba Electronics for several years. Jan Peter brings more than 20 years of management and executive experience in the semiconductor… Read More
Coherency in Heterogeneous Designs
Ever wonder why coherent networks are needed beyond server design? The value of cache coherence in a multi-core or many-core server is now well understood. Software developers want to write multi-threaded programs for such systems and expect well-defined behavior when accessing common memory locations. They reasonably expect… Read More
Delivering 3D IC Innovations Faster
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More
ARC Processor Summit 2022 Your embedded edge starts here!
As embedded systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these embedded applications must be efficient to deliver high levels of performance within limited power… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet