If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More
Semiconductor Intellectual Property
Fail-Safe Electronics For Automotive
The automotive industry is on the brink of a revolutionary transformation, where predictive maintenance and monitoring are taking center stage. In a recent webinar panel session, industry experts delved into the challenges, current approaches, and future innovations surrounding the guarantee and extension of mission profiles.… Read More
Agile Analog Partners with sureCore for Quantum Computing
Quantum computing is the next big thing for the computing world. The semiconductor industry has been talking about it for years. It’s shiny, mysterious, and capable of some incredible things. Instead of using classical bits to represent information (which can be either a 0 or a 1), quantum computers use quantum bits or qubits… Read More
ReRAM Integration in BCD Process Revolutionizes Power Management Semiconductor Design
Weebit Nano, a leading developer of advanced memory technologies, recently announced a significant collaboration with DB HiTek, one of the top ten foundries of the world. The collaboration is designed to enable integration of Weebit’s Resistive Random-Access Memory (ReRAM) into DB HiTek’s 130nm Bipolar-CMOS-DMOS… Read More
RISC-V Summit Buzz – Launchpad Showcase Highlights Smaller Company Innovation
One of the goals of the recent RISC-V Summit was to demonstrate that the RISC-V movement is real – major programs by large organizations committing to development around the RISC-V ISA. I would say this goal was achieved. Many high-profile announcements and aggressive, new architectures based on RISC-V were presented. On day … Read More
Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More
Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
Company sharpens its strategy of delivering silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets
Ceva Inc. is an interesting company. Founded in November 2002, through the combination of the DSP IP licensing… Read More
RISC-V and Chiplets: A Panel Discussion
At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:
- Laurent Moll, COO of Arteris
- Aniket Saha, VP of Product Management of Tenstorrent
- Dale Greenley, VP of Engineering of Ventana
When Will Structured Assembly Cross the Chasm?
First, a quick definition. By “structured assembly,” I mean the collection of tools to support IP packaging with standardized interfaces, SoC integration based on those IPs together with bus fabric and other connectivity hookups, register definition and management in support of hardware/software interface definition, … Read More
Automated Constraints Promotion Methodology for IP to Complex SoC Designs
In the world of semiconductor design, constraints are essentially specifications and requirements that guide the implementation of a specific hardware or software component within a larger system. They dictate timing, area, power, performance, and of course functionality of a design, playing a crucial role in ensuring that… Read More


Disaggregating AI Compute to Break the Tokens Barrier