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Why It’s A Good Idea to Embed PVT Monitoring IP in SoCs

Why It’s A Good Idea to Embed PVT Monitoring IP in SoCs
by Daniel Payne on 02-16-2018 at 7:00 am

At Intel back in the late 1970’s we wanted to know what process corner each DRAM chip and wafer was trending at so we included a handful of test transistors in the scribe lines between the active die. Having test transistors meant that we could do a quick electrical test at wafer probe time to measure the P and N channel transistor… Read More


High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory

High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory
by Mitch Heins on 02-07-2018 at 10:00 am


High Bandwidth Memory (HBM) systems have been successfully used for some time now in the network switching and high-performance computing (HPC) spaces. Now, adding fuel to the HBM fire, there is another market that shares similar system requirements as HPC and that is Artificial Intelligence (AI), especially AI systems doing… Read More


Open Silicon Year in Review 2017

Open Silicon Year in Review 2017
by Daniel Nenni on 01-31-2018 at 7:00 am

If you are interested in what types of chips we will see in the coming years always ask an ASIC provider because they know. Companies of all sizes (small-medium-large) use ASIC companies to get their chips out in the least amount of time and at a minimum cost because that is what ASIC companies do.

IP is an important ingredient to the … Read More


IEDM 2017 – Controlling Threshold Voltage with Work Function Metals

IEDM 2017 – Controlling Threshold Voltage with Work Function Metals
by Scotten Jones on 01-26-2018 at 7:00 am

As I have said many times, IEDM is one of the premier conferences for semiconductor technology. On Sunday before the formal conference started I took the “Boosting Performance, Ensuring Reliability, Managing Variation in sub-5nm CMOS” short course. The second module in the course was “Multi-Vt Engineering… Read More


Thermal Modeling for ADAS goes MultiPhysics

Thermal Modeling for ADAS goes MultiPhysics
by Bernard Murphy on 01-18-2018 at 7:00 am

In electronic system design, we have grown comfortable with the idea that different regimes of analysis, such as the chip, the package and the system, or electrical, thermal and stress are more or less independent – what starts in one regime stays in that regime, give or take some margin information passed onto other regimes. And… Read More


FinFET ASICs for Networking, Data Center, AI and 5G

FinFET ASICs for Networking, Data Center, AI and 5G
by Daniel Nenni on 01-08-2018 at 12:00 pm

On the heels of successful seminars in Tokyo and Shanghai, eSilicon is starting the new year back in the cloud with a webinar version of the live events for those, like myself, who could not attend. The webinar will compress the 3 hour live event into 60 minutes which will provide a great place to start a conversation on your next chip… Read More


IEDM 2017 – imec Charting the Future of Logic

IEDM 2017 – imec Charting the Future of Logic
by Scotten Jones on 01-04-2018 at 12:00 pm

At the IEDM 2017, imec held an imec technology forum and presented several papers, I also had the opportunity to interview Anda Mocuta director of technology solutions and enablement. In this article I will summarize the keys points of what I learned about the future of logic. I will follow this up with a later article covering memory.… Read More


IEDM 2017 – Intel Versus GLOBALFOUNDRIES at the Leading Edge

IEDM 2017 – Intel Versus GLOBALFOUNDRIES at the Leading Edge
by Scotten Jones on 12-22-2017 at 9:00 am

As I have discussed in previous blogs, IEDM is one of the premier conferences to learn about the latest developments in semiconductor technology. … Read More


High Calibre Development Keeps Mentor on Top of the Game

High Calibre Development Keeps Mentor on Top of the Game
by Tom Simon on 12-07-2017 at 12:00 pm

One might be tempted to think that technology driven gains in computer performance might be enough to keep up with the needs of design and verification tools. We know that design complexity is increasing at a rate predicted by Moore’s Law. We also know that the performance of the computers used during IC development benefit from … Read More


Advanced ASICs – It Takes an Ecosystem

Advanced ASICs – It Takes an Ecosystem
by Mike Gianfagna on 11-26-2017 at 2:00 pm

I remember the days of the IDM (integrated device manufacturer). For me, it was RCA, where I worked for 15 years as the company changed from RCA to GE and then ultimately to Harris Semiconductor. It’s a bit of a cliché, but life was simpler then, from a customer point of view at least. RCA did it all. We designed all the IP, did the physical… Read More